Details

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BUY HCPL-7860P-500E https://www.utsource.net/itm/p/9517169.html

Parameter	Symbol	Min	Typ	Max	Unit
Supply Voltage	VCC	4.5	5.0	5.5	V
Output High Voltage	VOH	-	3.8	-	V (at IOL = 16 mA)
Output Low Voltage	VOL	-	0.2	-	V (at IOL = 16 mA)
Input Current	IF	10	20	50	mA
Propagation Delay Time	tpd	0.3	0.5	0.7	渭s
Rise Time	tr	-	0.1	-	渭s
Fall Time	tf	-	0.1	-	渭s
Isolation Voltage	VIORM	-	-	5000	VRMS
Operating Temperature	TOP	-40	-	105	掳C
Storage Temperature	TSTG	-55	-	125	掳C

Instructions for HCPL-7860P-500E

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 4.5V to 5.5V.
   • Connect the V_CC pin to a stable power source.

2. Input Signal:

   • Apply the input current (I_F) to the input pin, ensuring it is between 10mA and 50mA.
   • The input signal should be a logic level signal compatible with the specified input current range.

3. Output Signal:

   • The output high voltage (V_OH) will be approximately 3.8V when the output is high.
   • The output low voltage (V_OL) will be approximately 0.2V when the output is low.
   • Ensure the load connected to the output can handle the specified output voltages and currents.

4. Propagation Delay:

   • The propagation delay time (t_pd) is the time it takes for the output to respond to a change in the input signal. It ranges from 0.3渭s to 0.7渭s.

5. Rise and Fall Times:

   • The rise time (t_r) and fall time (t_f) are both typically 0.1渭s, indicating fast switching times.

6. Isolation:

   • The device provides an isolation voltage (V_IORM) of up to 5000V_RMS, ensuring safe operation in high-voltage environments.

7. Temperature Considerations:

   • The operating temperature range (T_OP) is from -40掳C to 105掳C.
   • The storage temperature range (T_STG) is from -55掳C to 125掳C.

8. Handling and Storage:

   • Handle the device with care to avoid damage from electrostatic discharge (ESD).
   • Store the device in a dry, cool environment within the specified storage temperature range.

9. Mounting and Soldering:

   • Follow recommended soldering profiles to ensure reliable connections.
   • Avoid excessive heat during soldering to prevent damage to the device.

10. Testing:

    • Test the device under controlled conditions to verify proper operation before integrating it into a larger system.

(For reference only)