Details

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Good quality

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Forward Voltage	Vf	0.8	1.0	1.2	V	IF = 50 mA, Ta = 25掳C
Reverse Current	Ir	-	1.0	-	渭A	VR = 5 V, Ta = 25掳C
Peak Forward Current	Ifsm	-	1.0	-	A	t = 10 ms, Ta = 25掳C
Operating Temperature	Topr	-40	-	85	掳C	-
Storage Temperature	Tstg	-65	-	150	掳C	-
Thermal Resistance	Rth	-	150	-	K/W	Junction to Ambient

Instructions for Use:

1. Mounting:

   • Ensure the component is mounted on a clean and flat surface.
   • Use appropriate soldering techniques to avoid thermal shock.

2. Handling:

   • Handle the component with care to avoid mechanical damage.
   • Use ESD (Electrostatic Discharge) protection when handling to prevent damage from static electricity.

3. Operating Conditions:

   • Ensure the forward current (IF) does not exceed 50 mA to avoid overheating.
   • Keep the reverse voltage (VR) below 5 V to prevent breakdown.
   • Operate the component within the specified temperature range (-40掳C to 85掳C).

4. Storage:

   • Store the component in a dry and cool place.
   • Avoid exposure to extreme temperatures and humidity.

5. Testing:

   • Use a multimeter or appropriate testing equipment to verify the forward voltage (Vf) and reverse current (Ir).
   • Ensure the component is not subjected to peak forward current (Ifsm) for extended periods to prevent damage.

6. Soldering:

   • Preheat the PCB to 100掳C to 120掳C before soldering.
   • Use a soldering iron with a temperature setting between 300掳C and 350掳C.
   • Apply solder for no more than 3 seconds to each joint.

7. Thermal Management:

   • Consider using heat sinks or other cooling methods if the component will be operating near its maximum power dissipation.
   • Monitor the junction temperature to ensure it does not exceed the maximum thermal resistance (Rth) limits.

By following these guidelines, you can ensure the optimal performance and longevity of the STTH112U component.

(For reference only)