Details

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BUY MC68020EH33E https://www.utsource.net/itm/p/9756423.html
IC MPU M680X0 33MHZ 132QFP

Parameter	Description	Value	Unit
Device Type	Microprocessor	MC68020EH33E	-
Operating Voltage	Supply voltage range	5.0	V
Operating Frequency	Maximum clock frequency	33	MHz
Data Bus Width	Number of data lines	32	bits
Address Bus Width	Number of address lines	32	bits
Instruction Set	Type of instruction set architecture	CISC	-
Package Type	Type of package	PGA	-
Pin Count	Number of pins	179	-
Power Consumption	Typical power consumption	2.5	W
Operating Temperature	Range of operating temperatures	-40 to +85	°C
Storage Temperature	Range of storage temperatures	-65 to +150	°C
Mounting Type	Method of mounting	Through-hole	-
I/O Ports	Number of input/output ports	32	-
Cache	On-chip cache memory	256 bytes each	bytes
Fabrication Process	Semiconductor fabrication technology	CMOS	-
Minimum Order Quantity	Minimum quantity for order	1000	units

Instructions for Use

1. Power Supply:

   • Ensure that the supply voltage is within the specified range (5.0V).
   • Use appropriate decoupling capacitors (0.1μF and 10μF) close to the power pins to reduce noise.

2. Clock Input:

   • Connect the clock signal to the designated pin.
   • The maximum clock frequency is 33 MHz.

3. Reset and Initialization:

   • Apply a reset signal to the reset pin before initializing the microprocessor.
   • Follow the reset sequence as specified in the datasheet to ensure proper initialization.

4. Address and Data Buses:

   • Connect the address and data buses to the corresponding external devices.
   • Ensure that the bus lines are properly terminated to prevent signal reflections.

5. Interrupt Handling:

   • Configure the interrupt pins according to the application requirements.
   • Implement interrupt service routines (ISRs) to handle interrupts efficiently.

6. Memory and I/O Interface:

   • Connect external memory and I/O devices to the appropriate address and data lines.
   • Use the control signals (e.g., read/write, chip select) to manage memory and I/O operations.

7. Thermal Management:

   • Ensure adequate cooling to keep the operating temperature within the specified range (-40°C to +85°C).
   • Use heatsinks or other cooling methods if necessary.

8. Programming and Debugging:

   • Use a compatible development environment to write and debug code.
   • Utilize on-chip debugging features and external debug tools for efficient development.

9. Storage and Handling:

   • Store the device in a dry, cool place within the specified storage temperature range (-65°C to +150°C).
   • Handle the device with care to avoid damage to the pins and package.

10. Compliance and Standards:

    • Ensure compliance with relevant standards and regulations for the intended application.
    • Refer to the datasheet for detailed information on compliance and safety guidelines.

(For reference only)