Details

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BUY 2SK962 K962 https://www.utsource.net/itm/p/9775253.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Drain-Source Voltage	VDS	-	-	300	V	-
Gate-Source Voltage	VGS	-10	-	10	V	-
Continuous Drain Current	ID	-	2	5	A	TC = 25°C
Pulse Drain Current	IDpeak	-	8	10	A	tp = 10ms, f ≤ 100Hz
Total Power Dissipation	PT	-	-	40	W	TC = 25°C
Junction Temperature	TJ	-	-	175	°C	-
Storage Temperature	TSTG	-55	-	150	°C	-
Thermal Resistance (Junction to Case)	RθJC	-	1.25	-	°C/W	-

Instructions for Use:

1. Mounting and Handling:

   • Ensure proper handling to avoid static damage.
   • Use heat sinks to manage thermal resistance, especially when operating at high power levels.

2. Biasing:

   • Apply gate-source voltage (V_GS) within the specified range to control the drain current (I_D).
   • For optimal performance, keep V_GS within the typical operating range.

3. Operating Conditions:

   • Do not exceed the maximum drain-source voltage (V_DS) to prevent breakdown.
   • Ensure that the continuous drain current (I_D) does not exceed the maximum rating, especially at higher temperatures.
   • For pulse operations, adhere to the specified pulse duration (t_p) and frequency (f).

4. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it remains below the maximum limit.
   • Use appropriate cooling methods to maintain the device within safe operating temperatures.

5. Storage:

   • Store the device in a dry, cool environment within the specified storage temperature range (T_STG).

6. Testing:

   • Perform initial testing under controlled conditions to verify the device parameters and ensure it meets the required specifications.

(For reference only)