Details

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BUY STUW81300TR https://www.utsource.net/itm/p/9870249.html
VFQFPN 36 6X6X1.0 PI

Parameter	Description	Min	Typ	Max	Unit
VOUT	Output Voltage	2.5	-	3.3	V
IOUT	Output Current	-	300	-	mA
VIN	Input Voltage	4.5	-	20	V
Efficiency	Conversion Efficiency	-	90	-	%
Dropout Voltage	Dropout Voltage	0.3	-	1.0	V
Quiescent Current	Quiescent Current	-	20	-	μA
Operating Temperature	Operating Temperature Range	-40	-	85	°C
Storage Temperature	Storage Temperature Range	-65	-	150	°C
Package	Package Type	-	SOT-23-5	-	-

Instructions for Use:

1. Input Voltage (V_IN):

   • Ensure the input voltage is within the specified range of 4.5V to 20V.
   • Avoid exceeding the maximum input voltage to prevent damage to the device.

2. Output Voltage (V_OUT):

   • The output voltage is fixed at 2.5V or 3.3V, depending on the specific variant of the STUW81300TR.
   • Verify the output voltage is suitable for your application.

3. Output Current (I_OUT):

   • The device can provide up to 300mA of output current.
   • Ensure the load does not exceed this limit to avoid overheating or damage.

4. Efficiency:

   • The typical efficiency of the converter is 90%.
   • Optimize the input and output conditions to achieve the best efficiency.

5. Dropout Voltage:

   • The dropout voltage ranges from 0.3V to 1.0V.
   • Ensure the input voltage is sufficiently higher than the output voltage to maintain regulation.

6. Quiescent Current:

   • The quiescent current is typically 20μA.
   • This value is important for low-power applications.

7. Operating Temperature:

   • The device operates reliably within the temperature range of -40°C to 85°C.
   • Avoid operating the device outside this range to prevent performance degradation or failure.

8. Storage Temperature:

   • Store the device in an environment with temperatures between -65°C and 150°C to ensure long-term reliability.

9. Package:

   • The STUW81300TR is available in a SOT-23-5 package.
   • Follow standard PCB layout guidelines for SOT-23-5 components to ensure proper soldering and thermal management.

10. Layout Considerations:

    • Place the input and output capacitors close to the device to minimize parasitic inductance.
    • Use wide traces for power paths to reduce resistance and heat generation.
    • Ensure adequate thermal management, such as using a heatsink if necessary, especially for high current applications.

11. Capacitors:

    • Use ceramic capacitors with X7R dielectric for both input and output filtering.
    • Typical values for input and output capacitors are 10μF and 10μF, respectively.

12. PCB Design:

    • Follow the recommended PCB layout and design guidelines provided by the manufacturer to ensure optimal performance and reliability.

13. Testing:

    • Test the device under various operating conditions to verify its performance and stability.
    • Use a multimeter to check the output voltage and current.
    • Monitor the temperature of the device during operation to ensure it remains within safe limits.

(For reference only)