Details

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BUY NCV8406BDTRKG https://www.utsource.net/itm/p/9909757.html
IC DRIVER LOW SIDE DPAK

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VCC	2.5	-	5.5	V
Output Current (Continuous)	IOUT(cont)	-	1.2	-	A
Output Current (Peak)	IOUT(peak)	-	1.5	-	A
Quiescent Current	IQ	-	2.5	-	mA
Shutdown Current	ISD	-	0.1	-	μA
Operating Temperature	TOP	-40	-	125	°C
Storage Temperature	TSTG	-65	-	150	°C
Thermal Resistance (θJA)	-	-	60	-	°C/W

Instructions for Using NCV8406BDTRKG

1. Supply Voltage:

   • Ensure the supply voltage is within the range of 2.5V to 5.5V to avoid damage to the device.

2. Output Current:

   • The device can provide a continuous output current of up to 1.2A and a peak output current of up to 1.5A. Do not exceed these limits to prevent overheating or failure.

3. Quiescent Current:

   • The quiescent current is typically 2.5mA. This is the current consumed by the device when it is active but not driving any load.

4. Shutdown Current:

   • When the device is in shutdown mode, the current consumption drops to approximately 0.1μA. Use the shutdown feature to conserve power when the device is not needed.

5. Operating Temperature:

   • The device is designed to operate within a temperature range of -40°C to 125°C. Ensure that the ambient temperature does not exceed these limits to maintain reliable operation.

6. Storage Temperature:

   • Store the device in an environment with a temperature range of -65°C to 150°C to prevent damage during storage.

7. Thermal Management:

   • The thermal resistance (θ_JA) of the device is 60°C/W. Proper heat sinking or cooling mechanisms should be used if the device will be operating at high currents or in high-temperature environments to ensure adequate heat dissipation.

8. Installation:

   • Follow the recommended PCB layout guidelines to ensure proper thermal management and electrical performance. Use appropriate soldering techniques to avoid damaging the device during installation.

9. Testing:

   • After installation, test the device under typical operating conditions to ensure it meets the specified parameters and functions correctly.

10. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components. Use ESD protection measures when handling and installing the device.

(For reference only)