Details

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BUY VNQ05XSP16 https://www.utsource.net/itm/p/9910094.html
IC SSR HIGH SIDE QUAD POWERSO16

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VDD	4.5	-	5.5	V	Operating supply voltage
Continuous Output Current	IO	-	2.5	3.0	A	Maximum continuous output current
Peak Output Current	IOPK	-	5.0	5.5	A	Maximum peak output current
Thermal Shutdown	TSD	-	150	170	°C	Temperature at which thermal shutdown occurs
Operating Temperature	TA	-40	-	125	°C	Ambient operating temperature range
Storage Temperature	TSTG	-65	-	150	°C	Storage temperature range
Junction-to-Ambient Thermal Resistance	RθJA	-	60	-	°C/W	Thermal resistance from junction to ambient
Gate Charge	QG	-	20	25	nC	Total gate charge
Turn-on Delay Time	td(on)	-	20	40	ns	Time delay from gate to output turn-on
Rise Time	tr	-	20	40	ns	Time for output to rise from 10% to 90%
Turn-off Delay Time	td(off)	-	20	40	ns	Time delay from gate to output turn-off
Fall Time	tf	-	20	40	ns	Time for output to fall from 90% to 10%

Instructions:

1. Power Supply:

   • Ensure the supply voltage (V_DD) is within the specified range of 4.5V to 5.5V to avoid damage or improper operation.

2. Current Handling:

   • Do not exceed the continuous output current (I_O) of 3.0A or the peak output current (I_OPK) of 5.5A to prevent overheating and potential failure.

3. Thermal Management:

   • Monitor the operating temperature (T_A) to ensure it remains within the -40°C to 125°C range. Use appropriate heat sinks or cooling methods to manage the junction temperature, especially under high current conditions.

4. Thermal Shutdown:

   • The device will automatically shut down if the junction temperature reaches 150°C to 170°C. Allow the device to cool before resuming operation.

5. Storage Conditions:

   • Store the device in an environment where the temperature ranges from -65°C to 150°C to prevent damage during storage.

6. Gate Drive:

   • Ensure the gate drive circuitry can handle the total gate charge (Q_G) of up to 25nC to ensure reliable switching.

7. Switching Characteristics:

   • Consider the turn-on delay time (t_d(on)), rise time (t_r), turn-off delay time (t_d(off)), and fall time (t_f) when designing the switching circuit to minimize switching losses and ensure proper operation.

8. Mounting:

   • Follow recommended mounting procedures to ensure good thermal contact and mechanical stability. Use appropriate soldering techniques and avoid excessive thermal stress during assembly.

(For reference only)