Details

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BUY SN74HC132N https://www.utsource.net/itm/p/11190680.html
IC GATE NAND SCHMITT 4CH 14DIP

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC	-	2.0	-	6.0	V
Input Low Voltage	VIL	VCC = 4.5V to 5.5V	-	0.8	-	V
Input High Voltage	VIH	VCC = 4.5V to 5.5V	-	2.0	-	V
Output Low Voltage	VOL	IOL = 4mA, VCC = 4.5V to 5.5V	-	0.4	-	V
Output High Voltage	VOH	IOH = -0.4mA, VCC = 4.5V to 5.5V	-	2.4	-	V
Input Leakage Current	IIL	VCC = 4.5V to 5.5V	-	1.0	-	μA
Output Leakage Current	IOL	VCC = 4.5V to 5.5V	-	1.0	-	μA
Propagation Delay Time	tpd	VCC = 4.5V to 5.5V, TA = 25°C	-	10	-	ns
Power Dissipation	PD	Per Package	-	-	100	mW

Instructions for Use:

1. Power Supply:

   • The SN74HC132N operates with a supply voltage (V_CC) ranging from 2.0V to 6.0V. Ensure that the power supply is stable and within this range to avoid damage or incorrect operation.

2. Input Levels:

   • For reliable operation, input signals should be within the specified input low (V_IL) and input high (V_IH) voltage levels. These levels are typically 0.8V and 2.0V, respectively, for V_CC between 4.5V and 5.5V.

3. Output Levels:

   • The output low (V_OL) and output high (V_OH) voltages should be considered when interfacing with other components. Ensure that the load does not exceed the maximum current ratings for the output pins.

4. Leakage Current:

   • The input and output leakage currents are typically around 1.0μA. This should be taken into account when designing circuits with high impedance inputs or outputs.

5. Propagation Delay:

   • The propagation delay time (t_pd) is approximately 10ns at room temperature (25°C) and standard supply voltage. This parameter is crucial for timing considerations in digital circuits.

6. Power Dissipation:

   • The maximum power dissipation for the package is 100mW. Ensure that the device is not operated beyond this limit to prevent overheating and potential damage.

7. Handling:

   • The SN74HC132N is sensitive to electrostatic discharge (ESD). Use proper ESD protection measures when handling the device to avoid damage.

8. Mounting:

   • Follow standard surface mount technology (SMT) guidelines for mounting the device on a PCB. Ensure proper soldering and cooling to maintain reliability.

9. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat. Follow recommended storage conditions to ensure long-term reliability.

(For reference only)