Details

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BUY TPS2552DBVR-1 https://www.utsource.net/itm/p/11190751.html
IC PWR DIST SWITCH ADJ SOT23-6

Parameter	Symbol	Min	Typ	Max	Unit	Conditions/Notes
Input Voltage Range	VIN	3.0	-	5.5	V	-
Output Current	IOUT	-	2.0	2.4	A	Continuous, at 25°C ambient temperature
Quiescent Current	IQ	-	70	-	μA	At VIN = 5V, IOUT = 0A
Overcurrent Protection	ITRIP	2.4	-	2.8	A	Adjustable, typical value
Short-Circuit Current	ISC	-	3.6	-	A	Peak current during short circuit
Thermal Shutdown	TSD	-	160	-	°C	Typical thermal shutdown temperature
Operating Temperature	TOPR	-40	-	85	°C	Ambient operating temperature range
Storage Temperature	TSTG	-65	-	150	°C	Storage temperature range
Package Type	-	-	DSB	-	-	DSB (PowerPAD?) package

Instructions for Use:

1. Power Supply Connection:

   • Connect the input voltage (VIN) to the power supply.
   • Ensure the input voltage is within the specified range (3.0V to 5.5V).

2. Output Load Connection:

   • Connect the load to the output (VOUT).
   • The maximum continuous output current should not exceed 2.4A.

3. Overcurrent Protection:

   • The device has built-in overcurrent protection that trips at approximately 2.4A to 2.8A.
   • If the overcurrent condition persists, the device will automatically shut down to protect itself.

4. Thermal Management:

   • Ensure adequate heat dissipation to prevent the device from exceeding the thermal shutdown temperature (160°C).
   • Use a heatsink or other cooling methods if necessary, especially under high current conditions.

5. Short-Circuit Protection:

   • The device can handle short circuits up to a peak current of 3.6A.
   • However, prolonged short circuits can cause the device to overheat and trigger thermal shutdown.

6. Operating Temperature:

   • The device is designed to operate within an ambient temperature range of -40°C to 85°C.
   • Avoid exposing the device to temperatures outside this range to ensure reliable operation.

7. Storage:

   • Store the device in a dry environment with temperatures between -65°C and 150°C to prevent damage.

8. Package Handling:

   • Handle the DSB (PowerPAD?) package with care to avoid damaging the leads or the PowerPAD?.
   • Follow proper soldering techniques to ensure good thermal and electrical connections.

9. Capacitor Requirements:

   • Use appropriate input and output capacitors to stabilize the power supply and reduce noise.
   • Recommended values and types can be found in the datasheet.

10. Layout Considerations:

    • Place the device close to the load to minimize trace resistance and inductance.
    • Use wide and short traces for power and ground connections to reduce parasitic effects.

For more detailed information, refer to the TPS2552DBVR-1 datasheet provided by Texas Instruments.

(For reference only)