Details

---

BUY SMK0780FD https://www.utsource.net/itm/p/11234298.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VCC	2.7	-	5.5	V	Operating voltage range
Supply Current (Active)	ICC (Active)	-	1.5	3.0	mA	Supply current in active mode
Supply Current (Standby)	ICC (Standby)	-	0.1	0.5	渭A	Supply current in standby mode
Output Current (Per Channel)	IOUT	-	50	100	mA	Maximum output current per channel
Number of Channels	NCH	-	8	-	-	Number of output channels
Operating Temperature Range	TOP	-40	-	85	掳C	Temperature range for normal operation
Storage Temperature Range	TSTG	-65	-	150	掳C	Temperature range for storage
Input Voltage Range	VIN	0	-	VCC	V	Input voltage range for control signals
Output Voltage Drop	VDROP	-	0.3	0.5	V	Voltage drop across output when sourcing current
Rise Time	tR	-	1.0	2.0	渭s	Time to rise from 10% to 90% of output voltage
Fall Time	tF	-	1.0	2.0	渭s	Time to fall from 90% to 10% of output voltage
Propagation Delay	tPD	-	1.5	3.0	渭s	Time delay between input change and output response
Output Leakage Current	ILEAK	-	1.0	5.0	渭A	Leakage current at output when off
ESD Rating (HBM)	ESD	-	-	2000	V	Human Body Model (HBM) ESD rating
Package Type	-	-	DIP-16	-	-	Dual Inline Package with 16 pins

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.7V to 5.5V.
   • Connect the ground (GND) pin to the system ground.

2. Input Control:

   • Apply control signals to the input pins within the range of 0V to V_CC.
   • Use a logic high (V_CC) to turn on the corresponding output channel.
   • Use a logic low (0V) to turn off the corresponding output channel.

3. Output Configuration:

   • Each output channel can source up to 100mA of current.
   • Ensure the load connected to each output channel does not exceed the maximum current rating.
   • The output voltage drop (V_DROP) should be considered when designing the load circuit.

4. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to 85掳C for optimal performance.
   • Store the device within the temperature range of -65掳C to 150掳C to avoid damage.

5. Electrostatic Discharge (ESD) Protection:

   • Handle the device with care to avoid ESD damage.
   • The device has an ESD rating of 2000V (HBM), but it is still important to follow proper ESD handling procedures.

6. Timing Parameters:

   • Consider the propagation delay (t_PD) when designing timing-sensitive applications.
   • The rise time (t_R) and fall time (t_F) should be taken into account for fast-switching applications.

7. Leakage Current:

   • Account for the output leakage current (I_LEAK) when designing circuits that require very low standby currents.

8. Package Handling:

   • The device is available in a DIP-16 package.
   • Follow standard soldering and handling guidelines for DIP packages to ensure reliable connections and prevent damage.

(For reference only)