Details

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BUY KA5M0365RYDTU https://www.utsource.net/itm/p/11234299.html

Parameter	Description	Value	Unit
Part Number	Component Identifier	KA5M0365RYDTU	-
Type	Component Type	MOSFET	-
VDS	Drain-Source Voltage	650	V
VGS	Gate-Source Voltage	卤20	V
ID	Continuous Drain Current	10	A
RDS(on)	On-State Resistance at VGS=10V	0.36	惟
Power Dissipation	Maximum Power Dissipation	140	W
Junction Temperature	Operating Temperature Range	-55 to +175	掳C
Package	Encapsulation Type	TO-220	-
Storage Temperature	Storage Temperature Range	-55 to +150	掳C

Instructions:

1. Handling:

   • Handle with care to avoid damage to the leads and body.
   • Use proper ESD (Electrostatic Discharge) precautions to prevent damage to the MOSFET.

2. Mounting:

   • Ensure the mounting surface is clean and flat.
   • Apply thermal paste between the MOSFET and heat sink for better thermal conductivity.
   • Tighten the mounting screws to the recommended torque specified by the heat sink manufacturer.

3. Soldering:

   • Preheat the PCB to 100掳C to 120掳C before soldering.
   • Use a temperature-controlled soldering iron set to 300掳C to 350掳C.
   • Solder each lead for no more than 3 seconds to avoid overheating the component.

4. Testing:

   • Before applying power, verify that the circuit connections are correct.
   • Use a multimeter to check for short circuits and open circuits.
   • Gradually increase the power supply voltage while monitoring the current and temperature.

5. Storage:

   • Store in a dry, cool place away from direct sunlight.
   • Keep in anti-static packaging to protect from ESD.

6. Operational Considerations:

   • Ensure the gate-source voltage does not exceed the maximum rating to avoid damage.
   • Monitor the junction temperature to ensure it stays within the operating range.
   • Use appropriate cooling solutions (e.g., heat sinks, fans) to manage heat dissipation.

(For reference only)