FQP70N10

FQP70N10

Category: Transistors

Specifications
SKU
11241339
Details

BUY FQP70N10 https://www.utsource.net/itm/p/11241339.html

Parameter Symbol Min Typ Max Unit Conditions
Drain-Source Voltage VDS - - 100 V -
Gate-Source Voltage VGS -20 - 20 V -
Continuous Drain Current ID - 70 - A TC = 25掳C
Pulse Drain Current ID(p) - 140 - A TC = 25掳C, tp = 10 ms, IG = 5 A
Total Power Dissipation PTOT - - 115 W TC = 25掳C
Junction Temperature TJ - - 150 掳C -
Storage Temperature TSTG -55 - 150 掳C -
Thermal Resistance, Junction to Case R胃JC - - 0.56 掳C/W -

Instructions for Use:

  1. Handling:

    • Handle the FQP70N10 with care to avoid damage to the leads and the body.
    • Use proper ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.
  2. Mounting:

    • Ensure that the device is securely mounted to a heatsink if operating at high power levels.
    • Use thermal compound between the device and the heatsink to improve heat transfer.
  3. Biasing:

    • Apply the gate voltage (VGS) carefully to avoid exceeding the maximum ratings.
    • Ensure that the gate-source voltage is within the specified range to prevent damage to the gate oxide.
  4. Current Limiting:

    • Do not exceed the continuous drain current (ID) or pulse drain current (ID(p)) ratings.
    • Use appropriate current limiting resistors if necessary to protect the device.
  5. Temperature Management:

    • Monitor the junction temperature (TJ) to ensure it does not exceed the maximum rating.
    • Ensure adequate cooling to maintain the device within its safe operating area.
  6. Storage:

    • Store the device in a dry, cool place within the specified storage temperature range.
    • Avoid exposure to corrosive environments.
  7. Testing:

    • Use appropriate test equipment and methods to verify the performance of the device.
    • Follow the datasheet recommendations for testing parameters and conditions.
  8. Soldering:

    • Use a controlled soldering process to avoid overheating the device.
    • Follow the recommended soldering profile to ensure reliable connections without damaging the device.
(For reference only)

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