Details

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BUY DM74ALS244AN https://www.utsource.net/itm/p/11241779.html
IC BUF NON-INVERT 5.5V 20DIP

Parameter	Description	Min	Typ	Max	Unit
Supply Voltage (VCC)	Operating supply voltage range	1.8	-	5.5	V
Output Current (IOL)	Output low-level current	-60	-	-	mA
Output Current (IOH)	Output high-level current	-	-	16	mA
Input Current (IIL)	Input low-level current	-1	-	-	μA
Input Current (IIH)	Input high-level current	-	-	20	μA
Propagation Delay Time (tpd)	Time delay from input to output	-	12	-	ns
Power Dissipation (PD)	Maximum power dissipation	-	-	500	mW
Operating Temperature Range (TA)	Ambient temperature range for operation	-40	-	85	°C
Storage Temperature Range (TSTG)	Temperature range for storage	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 1.8V to 5.5V.
   • Connect the ground (GND) pin to a stable reference ground.

2. Input Signals:

   • Apply input signals to the data input pins (pins 1-8 and 14-21).
   • Ensure that the input currents (I_IL and I_IH) do not exceed the specified limits.

3. Output Signals:

   • Connect the output pins (pins 9-16) to the load or next stage circuitry.
   • Ensure that the output currents (I_OL and I_OH) do not exceed the specified limits to avoid damage to the device.

4. Propagation Delay:

   • Account for the propagation delay time (t_pd) in your timing calculations to ensure proper signal synchronization.

5. Temperature Considerations:

   • Operate the device within the specified operating temperature range (T_A) to ensure reliable performance.
   • Store the device within the specified storage temperature range (T_STG) to prevent damage.

6. Power Dissipation:

   • Ensure that the power dissipation (P_D) does not exceed 500 mW to avoid overheating and potential failure.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow proper soldering techniques to avoid thermal shock and mechanical stress.

8. Testing:

   • Test the device under controlled conditions to verify its functionality before integrating it into the final application.

(For reference only)