Details

---

BUY SN74LS367AN https://www.utsource.net/itm/p/11242657.html
IC BUF NON-INVERT 5.25V 16DIP

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	-	4.75	5.0	5.25	V
Input Voltage (High Level)	VIH	-	2.0	-	5.0	V
Input Voltage (Low Level)	VIL	-	0.0	-	0.8	V
Output Voltage (High Level)	VOH	IOL = 0.4 mA	2.4	-	5.0	V
Output Voltage (Low Level)	VOL	IOH = 16 mA	0.0	-	0.5	V
Input Current (High Level)	IIH	VI = 5.0 V	-0.04	-	-	mA
Input Current (Low Level)	IIL	VI = 0.0 V	-0.4	-	-	mA
Output Current (High Level)	IOH	VO = 2.4 V	-0.4	-	-	mA
Output Current (Low Level)	IOL	VO = 0.4 V	-16	-	-	mA
Propagation Delay Time	tpd	VCC = 5.0 V, TA = 25°C	12	-	18	ns
Power Dissipation	PD	Per Package	-	-	500	mW

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 4.75 V to 5.25 V.
   • Connect the ground (GND) pin to a stable 0 V reference.

2. Input Signals:

   • For a high input level, ensure the input voltage (V_IH) is between 2.0 V and 5.0 V.
   • For a low input level, ensure the input voltage (V_IL) is between 0.0 V and 0.8 V.
   • Be aware of the input current requirements:
     • High-level input current (I_IH) should not exceed -0.04 mA.
     • Low-level input current (I_IL) should not exceed -0.4 mA.

3. Output Signals:

   • For a high output level, the output voltage (V_OH) will be between 2.4 V and 5.0 V when the output current (I_OH) is 0.4 mA.
   • For a low output level, the output voltage (V_OL) will be between 0.0 V and 0.5 V when the output current (I_OL) is 16 mA.

4. Propagation Delay:

   • The propagation delay time (t_pd) is the time it takes for the output to change state after the input changes. At a supply voltage of 5.0 V and ambient temperature of 25°C, the typical propagation delay is 12 to 18 ns.

5. Power Dissipation:

   • The maximum power dissipation per package is 500 mW. Ensure proper heat dissipation if operating near this limit.

6. Handling:

   • Handle the device with care to avoid static damage. Use appropriate ESD protection measures.

7. Storage:

   • Store the device in a dry, cool place to prevent moisture damage. Follow the storage guidelines provided by the manufacturer.

8. Testing:

   • Before integrating the device into your circuit, test its functionality using a breadboard or a similar setup to ensure it meets the required specifications.

For more detailed information, refer to the datasheet provided by Texas Instruments or the specific manufacturer.

(For reference only)