Details

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BUY PCA82C250T/YM,112 https://www.utsource.net/itm/p/11242953.html
IC TRANSCEIVER HALF 1/1 8SO

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Differential Input Voltage	Vdiff	-2		2	V
Common-Mode Input Voltage	Vcm	-2		14	V
Output Voltage (High Level)	VOH		2.4	5	V	VCC = 5V, IOH = -4mA
Output Voltage (Low Level)	VOL	0	0.4		V	VCC = 5V, IOL = 16mA
Supply Voltage	VCC	4.75	5	5.25	V
Quiescent Current	IQ		1.3		mA	VCC = 5V, No Load
Thermal Shutdown Current	ITSD		30		μA	VCC = 5V, Tj > 150°C
Operating Temperature Range	Toper	-40		125	°C
Storage Temperature Range	Tstg	-65		150	°C

Instructions for Use:

1. Supply Voltage:

   • Ensure the supply voltage (VCC) is within the range of 4.75V to 5.25V to avoid damage to the device.

2. Differential Input Voltage:

   • The differential input voltage (Vdiff) should not exceed ±2V to prevent damage to the internal circuits.

3. Common-Mode Input Voltage:

   • The common-mode input voltage (Vcm) should be within the range of -2V to 14V to ensure proper operation.

4. Output Voltage Levels:

   • For high-level output (VOH), ensure it is at least 2.4V when VCC is 5V and the output current (IOH) is -4mA.
   • For low-level output (VOL), ensure it does not exceed 0.4V when VCC is 5V and the output current (IOL) is 16mA.

5. Thermal Management:

   • Monitor the operating temperature (Toper) to ensure it stays within the -40°C to 125°C range.
   • If the junction temperature (Tj) exceeds 150°C, the device will enter thermal shutdown, reducing the current to approximately 30μA to protect the device.

6. Storage:

   • Store the device in an environment with a temperature range of -65°C to 150°C to prevent damage.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.

8. Mounting:

   • Ensure proper mounting and soldering techniques to avoid mechanical stress on the device.
   • Use appropriate cooling methods if the device is expected to operate at high temperatures or under high load conditions.

9. Testing:

   • Before final assembly, test the device to ensure it meets all specified parameters and operates correctly under intended conditions.

10. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for the intended application.

(For reference only)