CY62126EV30LL-45ZSXI

CY62126EV30LL-45ZSXI

Category: IC Chips

Specifications
SKU
11243277
Details

BUY CY62126EV30LL-45ZSXI https://www.utsource.net/itm/p/11243277.html
IC SRAM 1M PARALLEL 44TSOP II
Parameter Description Value
Device Type 1M x 8-Bit CMOS Low Power SRAM with 3.0V Operation -
Manufacturer Cypress Semiconductor -
Package 30-Pin TSOP II (TSSOP) -
Supply Voltage (Vcc) Operating Voltage Range 2.7V to 3.6V
Standby Current (Icc) Typical at Vcc = 3.0V, Ta = 25°C 1.0 μA
Active Current (Icc) Typical at Vcc = 3.0V, f = 45 MHz, Ta = 25°C 15 mA
Access Time (tAA) Typical at Vcc = 3.0V, f = 45 MHz, Ta = 25°C 10 ns
Data Retention Time Minimum 20 years
Operating Temperature Range (Ta) Industrial -40°C to +85°C
Storage Temperature Range (Tstg) -65°C to +150°C -
Write Cycle Time (tWC) Maximum at Vcc = 3.0V, Ta = 25°C 15 ns
Output Enable Time (tOE) Maximum at Vcc = 3.0V, Ta = 25°C 10 ns
Chip Enable Time (tCE) Maximum at Vcc = 3.0V, Ta = 25°C 10 ns
Write Enable Time (tWE) Maximum at Vcc = 3.0V, Ta = 25°C 10 ns
Address Setup Time (tAS) Minimum at Vcc = 3.0V, Ta = 25°C 5 ns
Address Hold Time (tAH) Minimum at Vcc = 3.0V, Ta = 25°C 3 ns
Output Disable Time (tOHZ) Maximum at Vcc = 3.0V, Ta = 25°C 10 ns
Power-down Mode Supports Yes
Pin Configuration - -
Ordering Information Part Number CY62126EV30LL-45ZSXI

Instructions:

  1. Power Supply:

    • Ensure that the supply voltage (Vcc) is within the specified range of 2.7V to 3.6V.
    • Use appropriate decoupling capacitors (0.1 μF and 10 μF) close to the power pins to stabilize the power supply.
  2. Signal Timing:

    • Follow the timing parameters for address setup (tAS), address hold (tAH), and other critical timing parameters to ensure reliable operation.
    • Use a stable clock source for the system to meet the access time (tAA) and write cycle time (tWC) requirements.
  3. Power Management:

    • To reduce power consumption, use the power-down mode by deactivating the chip enable (CE#) and output enable (OE#) signals.
    • Ensure that the standby current (Icc) is within the typical value of 1.0 μA when in power-down mode.
  4. Temperature Considerations:

    • Operate the device within the industrial temperature range of -40°C to +85°C.
    • Store the device within the storage temperature range of -65°C to +150°C.
  5. Handling and Storage:

    • Handle the device with care to avoid static damage.
    • Store the device in a dry environment to prevent moisture-related issues.
  6. Testing and Validation:

    • Perform thorough testing and validation to ensure the device meets the required performance specifications in your application.
(For reference only)

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