Details

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Parameter	Description	Value
Part Number	Full part number of the component	SDIN5C1-8G
Type	Type of component	NAND Flash Memory
Capacity	Storage capacity of the component	8 Gb
Interface	Data interface type	ONFI 2.3
Voltage (Vcc)	Operating voltage range	1.7 V to 1.95 V
Temperature	Operating temperature range	-40°C to +85°C
Package	Package type	BGA 169
Data Rate	Maximum data transfer rate	200 MB/s
Endurance	Program/Erase cycles	3,000 cycles
Retention	Data retention	10 years at 25°C
Organization	Internal memory organization	16 x 32 Gb
Die Size	Size of the die	172 mm2
RoHS Compliance	Compliance with RoHS standards	Yes

Instructions for Use

1. Power Supply:

   • Ensure that the supply voltage (Vcc) is within the specified range of 1.7 V to 1.95 V.
   • Connect the power supply to the appropriate pins on the BGA 169 package.

2. Interface Configuration:

   • Configure the ONFI 2.3 interface according to the device datasheet.
   • Ensure that the data lines, clock, and control signals are correctly connected.

3. Initialization:

   • After power-up, initialize the device by sending the appropriate commands as specified in the ONFI 2.3 standard.
   • Verify the device ID and status to ensure proper initialization.

4. Read/Write Operations:

   • Use the read and write commands to access the memory.
   • Ensure that the address and data lines are correctly set for each operation.
   • Follow the timing diagrams provided in the datasheet for correct timing of signals.

5. Erase Operations:

   • Before writing new data, perform a block erase operation if necessary.
   • Ensure that the block to be erased is not currently being accessed by another operation.

6. Error Handling:

   • Monitor the status registers for any errors during read, write, or erase operations.
   • Implement error handling routines to manage any detected issues.

7. Thermal Management:

   • Ensure that the operating temperature remains within the specified range of -40°C to +85°C.
   • Provide adequate cooling if the device is expected to operate in high-temperature environments.

8. Storage and Handling:

   • Store the device in a dry, static-free environment when not in use.
   • Handle the device with care to avoid damage to the BGA package.

9. End-of-Life Considerations:

   • Plan for the end-of-life of the device, considering its endurance of 3,000 program/erase cycles.
   • Implement wear-leveling algorithms to distribute write operations evenly across the memory.

For detailed information, refer to the specific datasheet and application notes provided by the manufacturer.

(For reference only)