Details

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BUY IKW40N120T2 https://www.utsource.net/itm/p/11244338.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Collector-Emitter Voltage	VCEO	-	-	1200	V	IC = 0, Tj = 25掳C
Emitter-Collector Voltage	VECS	-	-	1200	V	IE = 0, Tj = 25掳C
Gate-Emitter Voltage	VGE	-15	-	15	V	Tj = 25掳C
Continuous Collector Current	IC	-	-	40	A	Tc = 25掳C
Continuous Collector Current (Tc = 100掳C)	IC(Tc = 100掳C)	-	-	32	A	Tc = 100掳C
Continuous Drain Current (Pulsed)	IC(ton)	-	-	80	A	ton = 10 ms, Tj = 25掳C
Power Dissipation	PD	-	-	270	W	Tc = 25掳C
Junction to Case Thermal Resistance	Rth(j-c)	-	-	0.6	K/W	-
Junction to Ambient Thermal Resistance	Rth(j-a)	-	-	40	K/W	-
Storage Temperature Range	Tstg	-55	-	150	掳C	-
Operating Junction Temperature Range	Top	-55	-	150	掳C	-

Instructions for Use:

1. Mounting and Handling:

   • Ensure proper handling to avoid damage to the device.
   • Use appropriate mounting techniques to ensure good thermal contact with the heatsink.

2. Thermal Management:

   • Ensure adequate cooling to keep the junction temperature within the specified range.
   • Use a heatsink with sufficient thermal resistance to dissipate the power dissipation effectively.

3. Electrical Connections:

   • Connect the gate, emitter, and collector terminals correctly to avoid short circuits or incorrect operation.
   • Use suitable wire gauges and connectors to handle the rated currents.

4. Gate Drive:

   • Apply the correct gate-emitter voltage to ensure reliable turn-on and turn-off of the device.
   • Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).

5. Overvoltage Protection:

   • Implement overvoltage protection circuits to safeguard against voltage spikes that can exceed the maximum ratings.

6. Current Limiting:

   • Use current-limiting resistors or other methods to ensure the continuous collector current does not exceed the rated value.

7. Storage and Transportation:

   • Store the device in a dry, cool environment to prevent moisture damage.
   • Handle with care during transportation to avoid mechanical stress.

8. Testing:

   • Test the device under controlled conditions to ensure it meets the specified parameters before integrating it into the final application.

9. Compliance:

   • Ensure the device complies with all relevant safety and regulatory standards for the intended application.

(For reference only)