Details

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BUY 74ACTQ244SCX https://www.utsource.net/itm/p/11244421.html
IC BUF NON-INVERT 5.5V 20SOIC

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	VCC	2.0	-	5.5	V	-
Input Low Voltage	VIL	-	0.8	-	V	@ VCC = 3.3V, IL = 1.0mA
Input High Voltage	VIH	-	2.0	-	V	@ VCC = 3.3V, IH = -1.0mA
Output Low Voltage	VOL	-	0.2	-	V	@ VCC = 3.3V, IL = 32mA
Output High Voltage	VOH	-	3.1	-	V	@ VCC = 3.3V, IH = -32mA
Propagation Delay Time	tpd	-	2.0	3.5	ns	@ VCC = 3.3V, TA = 25°C
Power Dissipation	PD	-	-	365	mW	@ VCC = 3.3V, TA = 25°C
Operating Temperature	TOP	-40	-	125	°C	-
Storage Temperature	TSTG	-65	-	150	°C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.0V to 5.5V.
   • Connect the ground (GND) pin to a stable ground reference.

2. Input Signals:

   • Apply input signals such that the low-level input voltage (V_IL) is below 0.8V and the high-level input voltage (V_IH) is above 2.0V when V_CC is 3.3V.

3. Output Signals:

   • The output low voltage (V_OL) should be below 0.2V and the output high voltage (V_OH) should be above 3.1V when V_CC is 3.3V and the output current is within specified limits.

4. Propagation Delay:

   • The typical propagation delay time (t_pd) is 2.0ns at 3.3V and 25°C. Ensure your system timing accounts for this delay.

5. Thermal Considerations:

   • The device can operate within a temperature range of -40°C to 125°C. Store the device between -65°C and 150°C.

6. Power Dissipation:

   • The maximum power dissipation (P_D) is 365mW at 3.3V and 25°C. Ensure proper heat sinking or cooling if operating near this limit.

7. Handling:

   • Handle the device with care to avoid static damage. Use appropriate ESD protection measures.

8. Soldering:

   • Follow standard soldering procedures to avoid thermal stress on the device. Ensure the soldering temperature and duration are within recommended limits.

(For reference only)