Details

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BUY BYV26EGP https://www.utsource.net/itm/p/11244859.html
Super quick restore diode

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Forward Voltage	VF	-	1.0	1.3	V @ IF = 20mA
Reverse Breakdown Voltage	VR	-	50	100	V @ IR = 1渭A
Forward Current (Continuous)	IF	-	-	100	mA @ TA = 25掳C
Forward Current (Pulsed)	IF(s)	-	-	500	mA @ tp = 10ms, fs = 10Hz
Reverse Current	IR	-	100	500	nA @ VR = 50V, TA = 25掳C
Power Dissipation	PT	-	-	200	mW @ TA = 25掳C
Operating Temperature	TOP	-40	-	125	掳C
Storage Temperature	TSTG	-55	-	150	掳C
Thermal Resistance	R胃J-A	-	300	-	K/W

Instructions for Use:

1. Mounting: Ensure proper heat dissipation by mounting the BYV26EGP on a heatsink if operating at high current or power levels.
2. Reverse Voltage: Do not exceed the maximum reverse voltage to avoid damage.
3. Forward Current: Stay within the continuous and pulsed forward current ratings to prevent overheating.
4. Temperature Range: Operate within the specified temperature range to ensure reliable performance.
5. Storage: Store in a dry environment within the storage temperature range to avoid degradation.
6. Handling: Handle with care to avoid mechanical damage, especially to the leads.
7. Soldering: Use appropriate soldering techniques and temperatures to avoid thermal shock. Soldering temperature should not exceed 260掳C for more than 10 seconds.
8. Electrostatic Discharge (ESD): Take necessary precautions to prevent ESD, which can damage the component.

(For reference only)