Details

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BUY SN74LS374N https://www.utsource.net/itm/p/11246269.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions/Notes
Supply Voltage	VCC	4.75	-	5.25	V	Over full operating temperature range
Input Low Voltage	VIL	-	0.8	1.5	V	Over full operating temperature range
Input High Voltage	VIH	2.0	3.5	-	V	Over full operating temperature range
Output Low Voltage (Sink)	VOL	0.25	0.4	0.5	V	IOL = 16 mA, VCC = 5 V
Output High Voltage (Source)	VOH	2.7	3.5	4.9	V	IOH = -0.4 mA, VCC = 5 V
Input Leakage Current	IIL	-	-0.4	0.4	渭A	VIL = 0.4 V, VCC = 5 V
Input Leakage Current (High)	IIH	-	-0.4	0.4	渭A	VIH = 4.4 V, VCC = 5 V
Output Leakage Current	IOL	-	-100	100	nA	VOL = 5 V, VCC = 5 V
Propagation Delay Time	tpd	20	-	35	ns	VCC = 5 V, TA = 25掳C, typical value at VCC = 5 V
Power Dissipation	PD	-	150	-	mW	Per package, derated linearly above 25掳C
Operating Temperature Range	TA	-55	-	125	掳C	Commercial: 0掳C to 70掳C, Industrial: -40掳C to 85掳C
Storage Temperature Range	TSTG	-65	-	150	掳C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range (4.75 V to 5.25 V).
   • Connect the ground (GND) pin to a stable 0 V reference.

2. Input Signals:

   • Apply input signals (V_IL and V_IH) that meet the specified voltage levels.
   • Avoid exceeding the maximum input voltage (V_CC + 0.5 V).

3. Output Loads:

   • Ensure the output current (I_OL and I_OH) does not exceed the maximum ratings.
   • Use appropriate pull-up or pull-down resistors if necessary.

4. Propagation Delay:

   • Consider the propagation delay (t_pd) when designing timing-sensitive circuits.

5. Temperature Considerations:

   • Operate the device within the specified temperature ranges to ensure reliable performance.
   • For extended temperature ranges, use the industrial grade version.

6. Handling:

   • Handle the IC with care to avoid static damage.
   • Store in a dry environment to prevent moisture-related issues.

7. Mounting:

   • Follow recommended soldering profiles and mounting techniques to ensure proper thermal management and mechanical stability.

8. Testing:

   • Verify the functionality of the IC using a known good test setup before integrating it into a larger system.

(For reference only)