Details

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BUY SN75179BDR https://www.utsource.net/itm/p/11246376.html

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	VCC	4.75	-	5.25	V	-
Output Current (Source)	IOH	-	300	-	mA	VCC = 5V, TA = 25掳C
Output Current (Sink)	IOL	-	600	-	mA	VCC = 5V, TA = 25掳C
Input High Voltage	VIH	2.0	-	5.5	V	-
Input Low Voltage	VIL	0.8	-	2.0	V	-
Output High Voltage	VOH	2.4	-	5.0	V	IOH = -4.0mA
Output Low Voltage	VOL	0.4	-	0.5	V	IOL = 40.0mA
Propagation Delay Time	tpd	-	35	50	ns	VCC = 5V, TA = 25掳C
Power Dissipation	PD	-	-	625	mW	Per Output, TA = 25掳C
Operating Temperature Range	TA	-40	-	85	掳C	-
Storage Temperature Range	TSTG	-65	-	150	掳C	-

Instructions for Use:

1. Supply Voltage (V_CC):

   • Ensure the supply voltage is within the range of 4.75V to 5.25V to avoid damage to the device.

2. Output Current:

   • The device can source up to 300mA and sink up to 600mA per output. Ensure that the load does not exceed these limits to prevent overheating or damage.

3. Input Voltage Levels:

   • For reliable operation, ensure that the input high voltage (V_IH) is at least 2.0V and the input low voltage (V_IL) is no more than 2.0V.

4. Output Voltage Levels:

   • The output high voltage (V_OH) should be at least 2.4V when sourcing 4.0mA, and the output low voltage (V_OL) should be no more than 0.5V when sinking 40.0mA.

5. Propagation Delay:

   • The propagation delay time (t_pd) is typically 35ns under standard conditions (V_CC = 5V, T_A = 25掳C). This should be considered in timing-sensitive applications.

6. Power Dissipation:

   • Each output can dissipate up to 625mW. Ensure adequate heat dissipation if operating near this limit to avoid thermal damage.

7. Operating and Storage Temperature:

   • The device can operate within a temperature range of -40掳C to 85掳C and can be stored between -65掳C and 150掳C.

8. Handling:

   • Handle the device with care to avoid static damage. Use appropriate ESD protection measures during handling and installation.

9. Mounting:

   • Ensure proper mounting and soldering techniques to avoid mechanical stress on the device and to ensure good electrical connections.

10. Testing:

    • Before final assembly, test the device under typical operating conditions to ensure it meets the specified parameters.

(For reference only)