Details

---

BUY 74HC10D https://www.utsource.net/itm/p/11246382.html

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC		2.0		6.0	V
Input Low Voltage	VIL	IL = -0.1 mA	0.3		0.8	V
Input High Voltage	VIH	IH = 0.1 mA	2.0		3.5	V
Output Low Voltage	VOL	IOL = 4.0 mA	0.0		0.1	V
Output High Voltage	VOH	IOH = -0.4 mA	2.4		5.0	V
Propagation Delay Time	tpd	VCC = 5V, TA = 25掳C	6.0	9.0	12.0	ns
Power Dissipation	PD	Continuous, per package			100	mW
Operating Temperature	TA		-40		85	掳C
Storage Temperature	TSTG		-65		150	掳C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.0V to 6.0V.
   • Connect the ground (GND) pin to a stable 0V reference.

2. Input Signals:

   • Apply input signals that meet the specified input low (V_IL) and high (V_IH) voltage levels.
   • Avoid exceeding the maximum ratings for input currents.

3. Output Signals:

   • The output low (V_OL) and high (V_OH) voltages should be within the specified ranges.
   • Ensure that the output current does not exceed the maximum ratings to avoid damage.

4. Propagation Delay:

   • The propagation delay time (t_pd) is critical for timing considerations. It varies with supply voltage and temperature.

5. Temperature Considerations:

   • Operate the device within the specified operating temperature range (-40掳C to 85掳C).
   • Store the device within the storage temperature range (-65掳C to 150掳C).

6. Power Dissipation:

   • Do not exceed the maximum power dissipation (P_D) of 100 mW to prevent overheating and potential damage.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal circuits.
   • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.

8. Mounting:

   • Ensure proper mounting on a PCB to maintain mechanical stability and thermal performance.
   • Use appropriate soldering techniques to avoid thermal shock and mechanical stress.

(For reference only)