Details

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BUY IS25C16-2ZLI https://www.utsource.net/itm/p/11250164.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	Vcc	Operating	2.7	-	3.6	V
Standby Current	Icc	Vcc = 3.0V, Standby	-	1.0	-	μA
Active Current	Icc	Vcc = 3.0V, Active	-	2.0	-	mA
Write Current	Icc	Vcc = 3.0V, Writing	-	4.0	-	mA
Data Retention Time			20	-	-	Years
Operating Temperature			-40	-	85	°C
Storage Temperature			-65	-	150	°C
Programming Time	tPROG	Page Program	-	3.0	-	ms
Sector Erase Time	tSE	Sector Erase	-	30.0	-	ms
Chip Erase Time	tCE	Chip Erase	-	200.0	-	ms
Data Output High Level	VOH	Vcc = 3.0V, IOL = -0.4mA	2.4	-	-	V
Data Output Low Level	VOL	Vcc = 3.0V, IOH = 0.4mA	-	-	0.4	V
Input High Level	VIH		2.0	-	-	V
Input Low Level	VIL		-	-	0.8	V

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the range of 2.7V to 3.6V.
   • The device should be powered down properly to avoid data corruption.

2. Current Consumption:

   • Monitor the standby current (Icc) to ensure it does not exceed 1.0μA at 3.0V.
   • During active operations, the current consumption should be around 2.0mA at 3.0V.
   • When writing data, the current can go up to 4.0mA at 3.0V.

3. Temperature Range:

   • The operating temperature range is from -40°C to 85°C.
   • The storage temperature range is from -65°C to 150°C.

4. Programming and Erasing:

   • Page programming typically takes about 3.0ms.
   • Sector erase operations take approximately 30.0ms.
   • Chip erase operations take around 200.0ms.

5. Data Retention:

   • The device retains data for at least 20 years under normal operating conditions.

6. Input/Output Levels:

   • Ensure that the data output high level (VOH) is at least 2.4V when Vcc is 3.0V and IOL is -0.4mA.
   • The data output low level (VOL) should not exceed 0.4V when Vcc is 3.0V and IOH is 0.4mA.
   • The input high level (VIH) should be at least 2.0V.
   • The input low level (VIL) should not exceed 0.8V.

7. Handling and Storage:

   • Handle the device with care to avoid static discharge, which can damage the component.
   • Store the device in a dry, cool place within the specified storage temperature range.

8. Programming and Configuration:

   • Refer to the device datasheet for specific commands and sequences required for programming and erasing operations.
   • Use appropriate software or hardware tools to interface with the device and perform these operations.

For more detailed information, refer to the official datasheet provided by the manufacturer.

(For reference only)