Details

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BUY TPS61020DRCR https://www.utsource.net/itm/p/11250317.html

Parameter	Symbol	Min	Typical	Max	Unit
Input Voltage	VIN	1.8	-	5.5	V
Output Voltage	VOUT	3.3	-	5.5	V
Output Current	IOUT	-	300	400	mA
Quiescent Current	IQ	-	25	-	μA
Shutdown Current	ISD	-	0.1	-	μA
Switching Frequency	fSW	-	1.5	-	MHz
Efficiency (VIN = 3.3V)	η	-	90	-	%
Efficiency (VIN = 1.8V)	η	-	80	-	%
Operating Temperature Range	TOPR	-40	-	85	°C
Storage Temperature Range	TSTG	-65	-	150	°C

Instructions for Use:

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 1.8V to 5.5V.
   • Connect the input voltage to the VIN pin.

2. Output Voltage (VOUT):

   • The output voltage can be set from 3.3V to 5.5V using external resistors.
   • Connect the output voltage to the VOUT pin.

3. Output Current (IOUT):

   • The device can deliver up to 400mA, with a typical current of 300mA.
   • Ensure the load does not exceed the maximum output current to avoid damage.

4. Quiescent Current (IQ):

   • The quiescent current is typically 25μA, which helps in maintaining low power consumption during operation.

5. Shutdown Current (ISD):

   • When the shutdown pin is activated, the device draws only 0.1μA of current, significantly reducing power consumption.

6. Switching Frequency (fSW):

   • The switching frequency is fixed at 1.5MHz, which allows for the use of small external components.

7. Efficiency:

   • The efficiency of the device is around 90% when the input voltage is 3.3V and around 80% when the input voltage is 1.8V.
   • Optimize the efficiency by selecting appropriate external components and ensuring proper PCB layout.

8. Operating Temperature Range (TOPR):

   • The device operates reliably within the temperature range of -40°C to 85°C.

9. Storage Temperature Range (TSTG):

   • Store the device in an environment with temperatures ranging from -65°C to 150°C to ensure long-term reliability.

10. PCB Layout:

    • Use a compact and efficient PCB layout to minimize parasitic inductance and capacitance.
    • Place the input and output capacitors close to the respective pins to reduce noise and improve stability.

11. External Components:

    • Select external components such as inductors and capacitors based on the recommended values in the datasheet to ensure optimal performance.

12. Thermal Management:

    • Ensure adequate heat dissipation by providing a thermal path or using a heatsink if necessary, especially under high load conditions.

13. Protection Features:

    • The device includes overcurrent protection and thermal shutdown to prevent damage under fault conditions.

(For reference only)