Details

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BUY 85C497 https://www.utsource.net/itm/p/11251490.html

Parameter	Symbol	Min	Typical	Max	Unit	Description
Supply Voltage	Vcc	4.75	5.0	5.25	V	Operating supply voltage
Standby Current	ISB	-	1.0	2.0	μA	Supply current in standby mode
Active Current	IOP	-	20	30	mA	Supply current in active mode
Input Low Voltage	VIL	0	0.8	1.5	V	Maximum input voltage to be recognized as low
Input High Voltage	VIH	3.5	4.2	5.0	V	Minimum input voltage to be recognized as high
Output Low Voltage	VOL	0	0.4	0.5	V	Maximum output voltage when low
Output High Voltage	VOH	4.5	4.8	5.0	V	Minimum output voltage when high
Output Sink Current	IOL	8	16	24	mA	Maximum output sink current
Output Source Current	IOH	-24	-16	-8	mA	Maximum output source current
Propagation Delay	tpd	-	10	15	ns	Time delay from input edge to output edge
Power Dissipation	PD	-	100	150	mW	Maximum power dissipation
Operating Temperature	TOPR	-40	-	85	°C	Range of ambient temperature for operation
Storage Temperature	TSTG	-65	-	150	°C	Range of ambient temperature for storage

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.75V to 5.25V.
   • Connect a bypass capacitor (0.1μF) between Vcc and GND close to the device to filter out noise.

2. Input Signals:

   • Inputs should be driven with voltages within the specified ranges for VIL and VIH to ensure proper logic levels.
   • Avoid floating inputs; tie unused inputs to Vcc or GND as appropriate.

3. Output Signals:

   • Outputs can sink/source up to 24mA/8mA respectively.
   • Use pull-up resistors if driving high-impedance loads or long lines.

4. Timing:

   • Consider the propagation delay (tpd) when designing timing-sensitive circuits.
   • Ensure that all signals meet the setup and hold time requirements relative to clock edges.

5. Thermal Management:

   • Monitor the power dissipation (PD) to avoid overheating.
   • Use heatsinks or improve airflow if operating near the maximum power dissipation limit.

6. Environmental Conditions:

   • Operate the device within the specified temperature ranges (TOPR and TSTG) to ensure reliability and longevity.
   • Store the device in a dry environment to prevent damage from moisture.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Follow ESD (Electrostatic Discharge) guidelines during assembly and testing.

(For reference only)