Details

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BUY XC3S200AN-4FTG256C https://www.utsource.net/itm/p/11251953.html

Parameter	Description	Value/Options
Device	Device Name	XC3S200AN-4FTG256C
Family	FPGA Family	Spartan-3A
Density	Logic Cells	200,000
Package	Package Type	FTG256 (Fine Pitch Thin Gull Wing)
Speed Grade	Speed Grade	-4
Supply Voltage (Vcc)	Core Supply Voltage	1.2V
I/O Voltage (Vcco)	I/O Supply Voltage	1.8V, 2.5V, 3.3V
Temperature Range	Operating Temperature Range	-40°C to +85°C
Configuration	Configuration Method	Serial Flash, BPI Flash, Parallel Flash, PROM, or JTAG
Configuration Memory	On-Chip Configuration Memory	1.5 Mbits (for serial configuration)
I/O Banks	Number of I/O Banks	16
I/O Pins	Total I/O Pins	172
Clock Resources	Dedicated Clock Inputs	8
Dedicated Clock Outputs	Dedicated Clock Outputs	8
PLLs	Phase-Locked Loops (PLLs)	2
Block RAM	Block RAM (Kbits)	180 Kbits
DSP Slices	DSP Slices	Not Available
Multiplier Resources	Multiplier Resources	40
Configuration Time	Typical Configuration Time	9 ms (for 1 Mbit)
Power Consumption	Static Power Consumption (typical)	100 mW
Dynamic Power	Dynamic Power Consumption (typical)	200 mW at 100 MHz
Package Pinout	Package Pinout Diagram	Refer to the datasheet for detailed pinout diagram
RoHS Compliance	RoHS Compliant	Yes
Lead Finish	Lead Finish	Matte Tin

Instructions:

1. Power Supply:

   • Ensure that the core supply voltage (Vcc) is set to 1.2V.
   • Set the I/O supply voltage (Vcco) according to your application requirements (1.8V, 2.5V, or 3.3V).

2. Configuration:

   • Choose a suitable configuration method (Serial Flash, BPI Flash, Parallel Flash, PROM, or JTAG).
   • For serial configuration, use the on-chip configuration memory (1.5 Mbits).

3. Clocking:

   • Utilize the dedicated clock inputs and outputs for clock distribution.
   • Use the two available PLLs for clock generation and management.

4. I/O Usage:

   • Distribute I/O signals across the 172 I/O pins, ensuring that the signals are assigned to appropriate I/O banks based on the required voltage levels.

5. Block RAM:

   • Utilize the 180 Kbits of block RAM for data storage and processing tasks.

6. Multiplier Usage:

   • Use the 40 multiplier resources for arithmetic operations.

7. Thermal Management:

   • Ensure adequate cooling to maintain the operating temperature within the specified range (-40°C to +85°C).

8. Pinout:

   • Refer to the datasheet for the detailed pinout diagram to ensure correct connections.

9. RoHS Compliance:

   • The device is RoHS compliant, ensuring it meets environmental standards.

10. Handling:

    • Handle the device with care to avoid damage to the leads and the package.

For more detailed information, refer to the official Xilinx datasheet and user guides.

(For reference only)