SN74LVC1G123DCTR

SN74LVC1G123DCTR

Category: IC Chips

Specifications
SKU
11252857
Details

BUY SN74LVC1G123DCTR https://www.utsource.net/itm/p/11252857.html
IC SNGL MONO MULTIVIBTOR SM8
Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 1.65 - 5.5 V -
Input Low Voltage VIL -0.5 - 0.8 V VCC = 1.65 to 5.5V
Input High Voltage VIH 2.0 - VCC + 0.5 V VCC = 1.65 to 5.5V
Output Low Voltage VOL 0 - 0.1 V IOL = 4 mA, VCC = 1.65 to 5.5V
Output High Voltage VOH VCC - 0.1 - VCC V IOH = -4 mA, VCC = 1.65 to 5.5V
Input Leakage Current IIL -1 - 1 μA VCC = 0 to 5.5V
Output Leakage Current IOL -1 - 1 μA VCC = 0 to 5.5V
Propagation Delay Time (High to Low) tpd(HL) - 5 - ns VCC = 3.3V, TA = 25°C, CL = 15 pF
Propagation Delay Time (Low to High) tpd(LH) - 5 - ns VCC = 3.3V, TA = 25°C, CL = 15 pF
Power Dissipation PD - - 100 mW -

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 1.65V to 5.5V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Input Signals:

    • Apply input signals (A, B) with voltages within the specified VIL and VIH ranges.
    • Ensure input signals are not below -0.5V or above VCC + 0.5V to avoid damage.
  3. Output Signals:

    • The output (Q) will be low (VOL) when both inputs are high.
    • The output (Q) will be high (VOH) when either input is low.
    • Ensure the load connected to the output does not exceed the maximum current ratings.
  4. Propagation Delay:

    • The propagation delay times (tpd(HL) and tpd(LH)) are given for typical conditions. Actual delays may vary based on VCC, temperature, and load capacitance.
  5. Operating Temperature:

    • The device is designed to operate within the commercial temperature range (-40°C to 85°C).
  6. Storage and Handling:

    • Store the device in a dry, static-free environment.
    • Handle with care to avoid mechanical stress and electrostatic discharge (ESD).
  7. Mounting:

    • Solder the device according to recommended reflow soldering profiles.
    • Ensure proper thermal management if operating at higher power levels or temperatures.
  8. Testing:

    • Verify the functionality of the device using a test setup that mimics the intended application conditions.
  9. Compliance:

    • Ensure the device complies with relevant safety and regulatory standards for your specific application.
(For reference only)

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