FAN73901MX

FAN73901MX


Specifications
SKU
11255214
Details

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Parameter Symbol Min Typ Max Unit Notes
Input Voltage VIN 4.5 - 26 V Operating range for the input supply voltage.
Output Voltage VOUT - 5.0 - V Typical output voltage under nominal conditions.
Quiescent Current IQ - 200 - μA Typical quiescent current at nominal operating conditions.
Shutdown Current ISD - 1 - μA Typical shutdown current.
Switching Frequency fSW 200 600 1000 kHz Range of switching frequency.
Maximum Output Current IOUT(max) - 1.5 - A Typical maximum output current.
Thermal Shutdown Temperature TSD - 160 - °C Temperature at which thermal shutdown is initiated.
Operating Temperature Range TA -40 - 125 °C Ambient temperature range for operation.
Storage Temperature Range TSTG -55 - 150 °C Temperature range for storage.

Instructions for Using FAN73901MX

  1. Power Supply Connection:

    • Connect the input voltage (VIN) to the power supply within the specified range (4.5V to 26V).
    • Ensure that the input voltage is stable and free from excessive ripple or noise.
  2. Output Configuration:

    • The output voltage (VOUT) is typically set to 5V, but can be adjusted using external components if required.
    • Use appropriate output capacitors to stabilize the output voltage and filter out any high-frequency noise.
  3. Current Limiting:

    • The device has an internal current limit to protect against overcurrent conditions.
    • If the load exceeds the maximum output current (1.5A), the device will enter a protection mode.
  4. Thermal Management:

    • Monitor the temperature of the device to ensure it does not exceed the thermal shutdown temperature (160°C).
    • Use heatsinks or other cooling methods if necessary to maintain the device within its operating temperature range (-40°C to 125°C).
  5. Shutdown Operation:

    • To put the device into shutdown mode, apply a low signal to the shutdown pin.
    • In shutdown mode, the device consumes minimal current (1μA).
  6. Storage and Handling:

    • Store the device in a dry environment within the storage temperature range (-55°C to 150°C).
    • Handle the device with care to avoid damage from static electricity or mechanical stress.
  7. Layout Considerations:

    • Place the device close to the load to minimize trace inductance and improve performance.
    • Use wide, short traces for power and ground connections to reduce resistance and inductance.
  8. Testing and Validation:

    • Before finalizing the design, perform thorough testing to ensure the device meets all performance requirements.
    • Validate the design under various operating conditions, including extreme temperatures and load variations.
(For reference only)

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