Details

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BUY TPS51716RUKR https://www.utsource.net/itm/p/11264162.html
IC REG CTRLR DDR 3OUT 20WQFN

Parameter	Symbol	Min	Typical	Max	Unit
Input Voltage	VIN	2.9	-	5.5	V
Output Voltage	VOUT	-	0.8 to 3.3 (Programmable)	-	V
Output Current	IOUT	-	2.5	-	A
Switching Frequency	fSW	-	2.1	-	MHz
Efficiency	η	-	90	-	%
Quiescent Current	IQ	-	100	-	μA
Shutdown Current	ISD	-	1	-	μA
Operating Temperature	TOPR	-40	-	125	°C
Storage Temperature	TSTG	-65	-	150	°C

Instructions for Using TPS51716RUKR

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 2.9V to 5.5V.
   • Use appropriate input capacitors to stabilize the input voltage.

2. Output Voltage (VOUT):

   • The output voltage can be programmed between 0.8V and 3.3V using external resistors.
   • Follow the formula provided in the datasheet to calculate the resistor values.

3. Output Current (IOUT):

   • The device can deliver up to 2.5A of continuous output current.
   • Ensure proper heat dissipation if operating at high current levels.

4. Switching Frequency (fSW):

   • The switching frequency is fixed at 2.1MHz.
   • Use appropriate inductors and capacitors to filter the output and minimize ripple.

5. Efficiency (η):

   • The efficiency is typically around 90%.
   • Optimize the design by selecting low ESR capacitors and inductors to achieve higher efficiency.

6. Quiescent Current (IQ):

   • The quiescent current is typically 100μA.
   • This value is important for low-power applications.

7. Shutdown Current (ISD):

   • The shutdown current is typically 1μA.
   • Use the shutdown pin to control the power state of the device.

8. Operating Temperature (TOPR):

   • The operating temperature range is from -40°C to 125°C.
   • Ensure adequate cooling or heat sinking for high-temperature environments.

9. Storage Temperature (TSTG):

   • The storage temperature range is from -65°C to 150°C.
   • Store the device in a dry and cool environment to prevent damage.

10. Layout Considerations:

    • Place the input and output capacitors as close as possible to the device.
    • Use wide and short traces for power connections to reduce parasitic inductance.
    • Ground planes should be large and solid to provide a low-impedance path for return currents.

11. Protection Features:

    • The device includes overcurrent protection, thermal shutdown, and undervoltage lockout (UVLO).
    • Ensure these features are properly configured to protect the device and system.

12. Programming the Output Voltage:

    • Use the feedback resistor network to set the desired output voltage.
    • Refer to the datasheet for the specific resistor values and configuration.

13. Application Notes:

    • Consult the application notes provided with the datasheet for detailed design guidelines and example circuits.
    • These notes often include PCB layout recommendations and component selection tips.

(For reference only)