Details

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BUY EP1C6F256C8N https://www.utsource.net/itm/p/11265542.html
IC FPGA 185 I/O 256FBGA

Parameter	Description	Value
Device Name	Cyclone I FPGA, 6K Logic Elements (LEs)	EP1C6F256C8N
Package	Fine Line Ball Grid Array (FBGA)	256-Pin
Speed Grade	-8
Logic Elements	Total number of logic elements	6,000
Embedded Memory	Total embedded memory in M4K blocks	230 Kbits
DSP Blocks	Number of dedicated digital signal processing blocks	10
I/O Pins	Total number of I/O pins	173
Configuration	Configuration modes	Active Serial, Passive Serial, JTAG, AS Configuration
Supply Voltage	Core voltage (VCCINT)	1.5V
I/O Voltage	I/O voltage (VCCIO)	1.5V, 1.8V, 2.5V, 3.3V
Temperature Range	Operating temperature range	-40°C to +85°C
Power Consumption	Typical power consumption (static)	100 mW
Clock Resources	Number of global clock networks	8
PLLs	Number of Phase-Locked Loops	2
Package Size	Package dimensions	14 x 14 mm
Pin Pitch	Pin pitch	0.8 mm

Instructions for Use

1. Power Supply Connections:

   • Connect VCCINT (1.5V) to the core power supply.
   • Connect VCCIO to the appropriate I/O voltage (1.5V, 1.8V, 2.5V, or 3.3V) based on your application.
   • Ensure all ground connections (GND) are properly connected.

2. Configuration:

   • Use the desired configuration mode (Active Serial, Passive Serial, JTAG, or AS Configuration).
   • Follow the specific configuration sequence and timing requirements as detailed in the device datasheet.

3. Clocking:

   • Utilize the global clock networks for distributing clock signals.
   • Configure the PLLs for generating required clock frequencies and phase adjustments.

4. I/O Usage:

   • Assign I/O pins according to the pinout diagram provided in the datasheet.
   • Set the I/O standards and drive strengths as needed for your application.

5. Thermal Management:

   • Ensure adequate cooling if operating at high power levels or in high-temperature environments.
   • Refer to the thermal design guidelines in the datasheet for recommended heat dissipation techniques.

6. Testing and Debugging:

   • Use boundary-scan (JTAG) for testing and debugging.
   • Verify correct configuration and operation using in-system programming (ISP) tools.

7. Storage and Handling:

   • Store the device in a dry environment to prevent moisture damage.
   • Handle with care to avoid static discharge and physical damage.

For more detailed information, refer to the official datasheet and user guide provided by Altera (now part of Intel).

(For reference only)