Details

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BUY XC95288XL-7BG256C https://www.utsource.net/itm/p/11270085.html
IC CPLD 288MC 7.5NS 256BGA

Parameter	Description	Value
Device Type	High-Density, Low-Cost CPLD	XC95288XL-7BG256C
Package	Ball Grid Array (BGA)	256 Balls
Operating Voltage	VCC Supply Voltage	1.8V ± 0.15V
I/O Voltage	I/O Supply Voltage	1.8V ± 0.15V
I/O Count	Number of I/O Pins	216
Logic Cells	Number of Logic Cells	288
Max Frequency	Maximum Operating Frequency	344 MHz (at 1.8V)
Configuration Memory	Non-Volatile Memory for Configuration Data	1.5 Mbits
Programming Method	JTAG, ISP (In-System Programming), BPI (Boundary-Scan Programming Interface)	JTAG, ISP, BPI
Temperature Range	Operating Temperature Range	-40°C to +85°C
Storage Temperature	Storage Temperature Range	-65°C to +150°C
Power Consumption	Typical Power Consumption	0.25 mW per MHz
Package Dimensions	Package Size	36 mm x 36 mm
Lead-Free	Lead-Free Compliant	Yes
RoHS Compliant	RoHS Compliant	Yes

Instructions for Use

1. Power Supply:

   • Ensure that the V_CC supply voltage is within the specified range of 1.8V ± 0.15V.
   • The I/O supply voltage should also be set to 1.8V ± 0.15V.

2. Configuration:

   • Use JTAG, ISP, or BPI for programming the device.
   • For JTAG, ensure that the TCK, TMS, TDI, and TDO pins are correctly connected.
   • For ISP, use the dedicated programming pins provided in the BGA package.

3. Operating Environment:

   • Operate the device within the temperature range of -40°C to +85°C.
   • Store the device in an environment with temperatures between -65°C and +150°C.

4. Power Management:

   • The device has low power consumption, typically 0.25 mW per MHz.
   • Ensure proper power management to avoid excessive heat generation.

5. Handling:

   • Handle the device with care to avoid damage to the BGA balls.
   • Follow ESD (Electrostatic Discharge) precautions to prevent damage to the device.

6. Testing:

   • After programming, verify the configuration using boundary-scan testing to ensure correct operation.

7. Documentation:

   • Refer to the datasheet and application notes for detailed information on specific features and advanced configurations.

(For reference only)