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Parameter | Symbol | Min | Typ | Max | Unit | Condition |
---|---|---|---|---|---|---|
Drain-Source Voltage | V(DS) | - | - | 55 | V | |
Gate-Source Voltage | V(GS) | -15 | - | 20 | V | |
Continuous Drain Current | I(D) | - | 33 | - | A | Tc = 25°C |
Pulse Drain Current | I(D) | - | 94 | - | A | Tp = 10ms, Duty = 1% |
Power Dissipation | P(TOT) | - | - | 175 | W | Rth(j-a) = 62.5 K/W |
Junction Temperature | Tj | - | - | 175 | °C | |
Storage Temperature | Tstg | -55 | - | 150 | °C |
Instructions for Use:
Mounting and Handling:
- Ensure proper heat sinking to manage the power dissipation.
- Handle with care to avoid damage to the gate oxide.
Biasing Conditions:
- Keep V(GS) within the specified limits to prevent gate damage.
- Ensure V(DS) does not exceed the maximum rating to avoid breakdown.
Operating Conditions:
- Monitor junction temperature; do not exceed 175°C to prevent thermal runaway.
- For continuous operation, ensure current ratings are adhered to, especially at higher temperatures.
Pulse Operation:
- During pulse operations, ensure duty cycle and pulse width comply with the specifications to avoid overheating.
Storage and Environment:
- Store in a controlled environment to prevent exposure to extreme temperatures that could affect performance or longevity.
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