Details

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BUY TZM5240B-GS08 https://www.utsource.net/itm/p/11274548.html
TZM5240B-GS08 Zener Diodes 10V 500mW/0.5W SOD80/LL34-10V marking high stability

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	VDD	1.7	-	3.6	V
Output Current	IOUT	-	100	200	mA	Continuous
Operating Temperature	TOPR	-40	-	85	掳C
Storage Temperature	TSTG	-65	-	150	掳C
Quiescent Current	IQ	-	1.2	2.5	渭A	@ VDD = 3.3V, TA = 25掳C
Input Capacitance	CIN	-	20	-	pF	@ VDD = 3.3V, f = 1MHz
Output Capacitance	COUT	-	20	-	pF	@ VDD = 3.3V, f = 1MHz
Shutdown Current	ISD	-	0.1	0.5	渭A	@ VDD = 3.3V, TA = 25掳C
Enable Input High Level	VIH	0.7	-	-	V	@ VDD = 3.3V, TA = 25掳C
Enable Input Low Level	VIL	-	0.3	-	V	@ VDD = 3.3V, TA = 25掳C

Instructions:

1. Supply Voltage (VDD):

   • Ensure the supply voltage is within the range of 1.7V to 3.6V to avoid damage to the device.

2. Output Current (IOUT):

   • The device can provide up to 200mA continuously. Ensure that the load does not exceed this limit to prevent overheating or failure.

3. Operating Temperature (TOPR):

   • The device operates reliably between -40掳C and 85掳C. Avoid operating outside these temperatures to ensure performance and longevity.

4. Storage Temperature (TSTG):

   • Store the device between -65掳C and 150掳C to prevent damage during storage.

5. Quiescent Current (IQ):

   • The quiescent current is typically 1.2渭A at 3.3V and 25掳C. This value helps in power budgeting for low-power applications.

6. Input Capacitance (CIN) and Output Capacitance (COUT):

   • Both input and output capacitances are typically 20pF at 3.3V and 1MHz. These values are important for stability and filtering considerations.

7. Shutdown Current (ISD):

   • When the device is in shutdown mode, the current draw is typically 0.1渭A at 3.3V and 25掳C. Use this mode to conserve power when the device is not in use.

8. Enable Input Levels (VIH and VIL):

   • The enable input high level (VIH) should be at least 0.7V, and the enable input low level (VIL) should be no more than 0.3V to ensure proper operation.

9. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components. Use appropriate ESD protection measures.

10. Mounting:

    • Follow recommended PCB layout guidelines to ensure optimal performance and thermal management. Proper grounding and decoupling capacitors are essential.

(For reference only)