Details

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BUY KTC4075-GR https://www.utsource.net/itm/p/11274687.html
KTC4075-GR NPN Transistors(BJT) 60V 150mA/0.15A 80Mhz 70~700 SOT-323/SC-70/USM marking L6 switch

Parameter	Description	Value
Part Number	Full Part Number	KTC4075-GR
Function	Type of Device	Low Dropout Linear Regulator (LDO)
Input Voltage Range	Operating Input Voltage Range	2.7V to 5.5V
Output Voltage	Fixed Output Voltage	3.3V
Output Current	Maximum Continuous Output Current	150mA
Dropout Voltage	Typical Dropout Voltage at 150mA	250mV
Quiescent Current	Quiescent Current at No Load	2.5渭A
Shutdown Current	Shutdown Current	0.1渭A
PSRR	Power Supply Rejection Ratio at 1kHz	60dB
Operating Temperature	Junction Temperature Range	-40掳C to +85掳C
Package	Package Type	SOT-23-5
Pin Configuration	Pin Assignment	1: IN, 2: GND, 3: OUT, 4: EN, 5: NC
Storage Temperature	Storage Temperature Range	-65掳C to +150掳C

Instructions for Use:

1. Power Supply Connection:

   • Connect the input voltage (VIN) to the IN pin.
   • Ensure the input voltage is within the specified range (2.7V to 5.5V).

2. Ground Connection:

   • Connect the ground (GND) to the GND pin.

3. Output Connection:

   • Connect the load to the OUT pin to receive the regulated output voltage (3.3V).

4. Enable Pin:

   • The EN pin can be used to enable or disable the regulator. Connect it to VIN to enable the device, or to GND to disable it.

5. Capacitors:

   • Place a 1渭F ceramic capacitor close to the IN pin and a 1渭F ceramic capacitor close to the OUT pin for stability and noise reduction.
   • Ensure the capacitors have a low ESR (Equivalent Series Resistance) for optimal performance.

6. Thermal Management:

   • Ensure adequate heat dissipation if the device is operating near its maximum output current.
   • Use a heatsink or PCB copper area to help dissipate heat if necessary.

7. Storage and Handling:

   • Store the device in a dry environment within the specified storage temperature range.
   • Handle with care to avoid damage to the pins and package.

8. Soldering:

   • Follow standard soldering practices for surface mount components.
   • Avoid excessive heat during soldering to prevent damage to the device.

(For reference only)