Details

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BUY BCW30LT1 https://www.utsource.net/itm/p/11274721.html
BCW30LT1 PNP transistors(BJT) -32V -100mA/-0.1A 215~500 -300mV/-0.3V SOT-23/SC-59 marking C2

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VDD	-0.3		5.5	V	Maximum supply voltage
Output Current	IO		100		mA	Continuous output current
Operating Temp.	TA	-40		85	掳C	Ambient operating temperature range
Storage Temp.	TSTG	-65		150	掳C	Storage temperature range
Quiescent Current	IQ		20		渭A	Quiescent current at 5V
Output Voltage	VO			0.2	V	Output voltage drop (low level)
Output Voltage	VO			0.1	V	Output voltage rise (high level)
Input Capacitance	CIN			10	pF	Input capacitance
Output Capacitance	COUT			10	pF	Output capacitance

Instructions for Using BCW30LT1

1. Supply Voltage:

   • Ensure the supply voltage is within the specified range of -0.3V to 5.5V to avoid damage to the device.

2. Output Current:

   • The device can provide up to 100mA of continuous output current. Exceeding this limit may cause overheating or damage.

3. Operating Temperature:

   • The device operates reliably within an ambient temperature range of -40掳C to 85掳C. Avoid exposing the device to temperatures outside this range during operation.

4. Storage Temperature:

   • Store the device in an environment with a temperature range of -65掳C to 150掳C to ensure long-term reliability.

5. Quiescent Current:

   • The quiescent current is typically 20渭A at a supply voltage of 5V. This value helps in power consumption calculations for low-power applications.

6. Output Voltage:

   • When the output is low, the voltage drop should not exceed 0.2V.
   • When the output is high, the voltage rise should not exceed 0.1V.

7. Capacitance:

   • The input and output capacitance should be kept below 10pF to maintain proper signal integrity and performance.

8. Handling:

   • Handle the device with care to avoid static discharge and physical damage.
   • Use appropriate ESD protection measures when handling the device.

9. Mounting:

   • Follow standard surface mount technology (SMT) guidelines for mounting the device on a PCB.
   • Ensure proper soldering and avoid excessive heat during the soldering process.

10. Testing:

    • Before finalizing the design, perform thorough testing under various conditions to ensure the device meets all performance specifications.

(For reference only)