Details

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BUY 2SC4050 https://www.utsource.net/itm/p/11276238.html
2SC4050 NPN Transistors(BJT) 120V 100mA/0.1A 400~800 1.1V SOT-23/SC-59/MPAK marking K1E low-frequency amplifier switch

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Collector-Emitter Voltage	VCEO	-	-	120	V	IC = 50 mA
Collector-Base Voltage	VCBO	-	-	80	V	IC = 50 mA
Emitter-Base Voltage	VEBO	-	-	5	V	IE = 5 mA
Collector Current	IC	-	50	150	mA	VCE = 30 V
Base Current	IB	-	5	15	mA	VCE = 30 V, IC = 50 mA
DC Current Gain	hFE	100	300	700	-	IC = 50 mA, VCE = 5 V
Transition Frequency	fT	-	300	-	MHz	IC = 50 mA, VCE = 10 V
Power Dissipation	PT	-	-	625	mW	TA = 25掳C
Junction Temperature	TJ	-	-	150	掳C	-
Storage Temperature Range	TSTG	-55	-	150	掳C	-

Instructions for Use:

1. Handling Precautions:

   • Handle the 2SC4050 with care to avoid damage to the leads and body.
   • Use proper anti-static precautions to prevent electrostatic discharge (ESD) damage.

2. Mounting:

   • Ensure that the mounting surface is clean and flat.
   • Apply thermal compound between the transistor and heat sink if necessary to improve thermal conductivity.
   • Secure the transistor firmly but avoid excessive torque on the leads to prevent mechanical stress.

3. Biasing:

   • Ensure that the base current (I_B) is sufficient to drive the transistor into saturation when required.
   • Use appropriate biasing circuits to maintain stable operation over temperature and supply voltage variations.

4. Heat Management:

   • Monitor the junction temperature (T_J) to ensure it does not exceed the maximum rating.
   • Use a heat sink if the power dissipation (P_T) is expected to be high.

5. Storage:

   • Store the 2SC4050 in a dry, cool place within the specified storage temperature range.
   • Keep the transistors in their original packaging until ready for use to protect against moisture and static damage.

6. Testing:

   • Test the 2SC4050 using a multimeter or transistor tester to verify its functionality before installation.
   • Check for continuity and correct polarity to avoid reverse biasing which can damage the device.

7. Soldering:

   • Use a soldering iron with a temperature-controlled tip to avoid overheating the transistor.
   • Solder quickly to minimize thermal stress on the device.
   • Allow the solder joints to cool naturally without applying mechanical stress.

(For reference only)