Details

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BUY TC7WU04FU https://www.utsource.net/itm/p/11285706.html
Integrated Circuit(IC) inverter TC7WU04FU SM8 marking U04

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	VCC	2.7	-	5.5	V
Output Current	IO	-	100	150	mA	Continuous
Peak Output Current	IOP	-	300	-	mA	Pulse (1% duty cycle)
Operating Temperature	TOPR	-40	-	85	掳C
Storage Temperature	TSTG	-55	-	150	掳C
Thermal Resistance	R胃JA	-	150	-	掳C/W
Input Capacitance	Cin	-	10	-	pF
Output Capacitance	Cout	-	50	-	pF
Rise Time	tr	-	10	-	ns
Fall Time	tf	-	10	-	ns
Propagation Delay Time	tpd	-	10	-	ns

Instructions for Use:

1. Supply Voltage (VCC):

   • Ensure the supply voltage is within the range of 2.7V to 5.5V to avoid damage to the device.

2. Output Current (IO):

   • The device can provide a continuous output current of up to 100mA. For short pulses, it can handle up to 300mA with a 1% duty cycle.

3. Operating Temperature (TOPR):

   • The operating temperature range is from -40掳C to 85掳C. Ensure the device is used within this range to maintain reliability.

4. Storage Temperature (TSTG):

   • Store the device in an environment where the temperature ranges from -55掳C to 150掳C.

5. Thermal Management:

   • The thermal resistance (R胃JA) is 150掳C/W. Proper heat dissipation measures should be taken if the device is expected to operate at high power levels or in high-temperature environments.

6. Capacitance:

   • The input capacitance (Cin) is typically 10pF, and the output capacitance (Cout) is typically 50pF. These values should be considered when designing the circuit to ensure stability and performance.

7. Timing Parameters:

   • The rise time (tr), fall time (tf), and propagation delay time (tpd) are all typically 10ns. These parameters are crucial for ensuring proper signal integrity and timing in your application.

8. Handling and Storage:

   • Handle the device with care to avoid static discharge and physical damage. Follow standard ESD precautions.

9. Mounting:

   • Ensure proper mounting and soldering techniques to avoid mechanical stress and ensure good electrical connections.

10. Testing:

    • Before integrating the device into a final design, perform thorough testing under various conditions to ensure it meets the required specifications.

(For reference only)