Details

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BUY FDN352AP https://www.utsource.net/itm/p/11288017.html
FDN352AP MOSFET P-Channel -30V -1.3A 0.15ohm SOT-23 marking 52ap

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Drain-Source Voltage	VDS	-	60	-	V
Gate-Source Voltage	VGS	-15	-	15	V
Continuous Drain Current	ID	-	4.5	-	A	TC = 25掳C
Pulse Drain Current	ID(pulse)	-	10	-	A	TC = 25掳C, tp = 10 ms, Duty Cycle = 1%
Gate Charge	QG	-	12	-	nC
Input Capacitance	Ciss	-	180	-	pF	VDS = 10 V, f = 1 MHz
Output Capacitance	Coss	-	35	-	pF	VDS = 10 V, f = 1 MHz
Reverse Transfer Capacitance	Crss	-	30	-	pF	VDS = 10 V, f = 1 MHz
Threshold Voltage	VGS(th)	1.0	1.5	2.5	V	ID = 250 渭A, TA = 25掳C
On-State Resistance	RDS(on)	-	0.12	-	惟	VGS = 4.5 V, ID = 4.5 A, TA = 25掳C
Power Dissipation	PD	-	2.1	-	W	TA = 25掳C
Operating Junction Temperature	TJ	-55	-	150	掳C
Storage Temperature Range	Tstg	-55	-	150	掳C

Instructions for Use:

1. Handling Precautions:

   • Handle the FDN352AP with care to avoid damage to the leads or the body.
   • Use proper ESD (Electrostatic Discharge) protection when handling the device.

2. Mounting:

   • Ensure that the mounting surface is clean and free from contaminants.
   • Apply thermal paste if necessary to improve heat dissipation.
   • Solder the device using a temperature-controlled soldering iron to avoid overheating.

3. Biasing:

   • Apply the gate-source voltage (V_GS) within the specified range to ensure reliable operation.
   • Ensure that the drain-source voltage (V_DS) does not exceed the maximum rating.

4. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it stays within the operating range.
   • Use a heatsink if the power dissipation exceeds the self-heating limits of the device.

5. Testing:

   • Test the device under controlled conditions to verify its performance.
   • Use appropriate test equipment to measure parameters such as on-state resistance (R_DS(on)) and threshold voltage (V_GS(th)).

6. Storage:

   • Store the FDN352AP in a dry, cool place away from direct sunlight.
   • Keep the device in its original packaging until ready for use to prevent damage.

(For reference only)