Details
BUY W21NM50N https://www.utsource.net/itm/p/11300684.html
Parameter | Symbol | Min | Typ | Max | Unit | Description |
---|---|---|---|---|---|---|
Drain-Source On-State Resistance | RDS(on) | - | 0.12 | - | Ω | At VGS = 10V, ID = 5A |
Gate-Source Voltage | VGS(th) | 1.0 | 2.0 | 4.0 | V | Gate threshold voltage |
Continuous Drain Current | ID | - | - | 50 | A | At Tc = 25°C |
Pulse Drain Current | IDM | - | - | 100 | A | Pulse duration 10ms, duty cycle 1% |
Power Dissipation | PD | - | - | 125 | W | At TC = 25°C |
Junction Temperature | TJ | -25 | - | 175 | °C | Operating junction temperature |
Storage Temperature | TSTG | -55 | - | 150 | °C | Storage temperature range |
Instructions for Use:
- Handling Precautions: The W21NM50N is sensitive to electrostatic discharge (ESD). Use appropriate ESD protection during handling and installation.
- Mounting: Ensure the device is mounted with adequate heat sinking if operating at high power levels to maintain junction temperature within specified limits.
- Gate Drive: Apply gate-source voltage within the specified range to avoid damage or improper operation. Ensure VGS does not exceed the maximum rating.
- Current Limitation: Do not exceed the continuous or pulse drain current ratings. Exceeding these can lead to device failure.
- Thermal Management: Monitor the junction temperature and ensure it remains within the operational range to prevent thermal runaway.
- Storage Conditions: Store in a dry environment within the specified storage temperature range to prevent damage.
- Soldering: Follow recommended soldering profiles to avoid thermal shock and potential damage to the device.
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