Details

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BUY TGAN40N60FD https://www.utsource.net/itm/p/11301248.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source Voltage	VDS	-	-	600	V	Maximum voltage between drain and source with gate open
Gate-Source Voltage	VGS	-15	-	20	V	Maximum voltage between gate and source
Continuous Drain Current	ID	-	40	-	A	Continuous current through the drain at TC = 25掳C
Pulse Drain Current	IDM	-	80	-	A	Non-repetitive peak pulse current through the drain
Power Dissipation	PTOT	-	-	300	W	Total power dissipation at TC = 25掳C
Junction Temperature	TJ	-	-	175	掳C	Maximum junction temperature
Storage Temperature	TSTG	-55	-	150	掳C	Operating and storage temperature range
Thermal Resistance	R胃JC	-	0.8	-	掳C/W	Junction-to-case thermal resistance
Input Capacitance	Ciss	-	1900	-	pF	Input capacitance at VDS = 300V, VGS = 0V
Output Capacitance	Coss	-	100	-	pF	Output capacitance at VDS = 300V, VGS = 0V
Reverse Transfer Capacitance	Crss	-	150	-	pF	Reverse transfer capacitance at VDS = 300V, VGS = 0V
Turn-on Delay Time	td(on)	-	45	-	ns	Turn-on delay time at ID = 20A, VGS = 15V
Rise Time	tr	-	55	-	ns	Rise time at ID = 20A, VGS = 15V
Turn-off Delay Time	td(off)	-	45	-	ns	Turn-off delay time at ID = 20A, VGS = 0V
Fall Time	tf	-	55	-	ns	Fall time at ID = 20A, VGS = 0V

Instructions for Use:

1. Handling Precautions:

   • Handle the device with care to avoid damage to the pins.
   • Use appropriate ESD (Electrostatic Discharge) protection when handling the device.

2. Mounting:

   • Ensure proper heat sinking to manage the thermal resistance and keep the junction temperature within safe limits.
   • Follow the recommended PCB layout guidelines to minimize parasitic inductances and ensure reliable operation.

3. Biasing:

   • Apply the gate-source voltage (V_GS) within the specified range to avoid damaging the gate oxide.
   • Ensure that the gate drive circuitry is capable of providing the necessary current to charge and discharge the gate capacitance quickly.

4. Operation:

   • Operate the device within the specified temperature and voltage ranges to ensure reliable performance.
   • Monitor the power dissipation and ensure it does not exceed the maximum rating to prevent overheating.

5. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat.
   • Keep the device in its original packaging until ready for use to protect against static discharge.

6. Testing:

   • Use appropriate test equipment and methods to verify the device parameters.
   • Refer to the datasheet for specific test conditions and procedures.

(For reference only)