Details

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BUY IXFH80N65X2 https://www.utsource.net/itm/p/11301446.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Drain-Source Voltage	VDSS	-	650	-	V
Gate-Source Voltage	VGSS	-15	-	15	V
Continuous Drain Current	ID	-	80	-	A	TC = 25掳C
Continuous Drain Current	ID	-	47	-	A	TC = 100掳C
Pulse Drain Current	IDM	-	240	-	A	TC = 25掳C, tp = 10 渭s, IGT = 10 A
Total Power Dissipation	PTOT	-	190	-	W	TC = 25掳C
Junction Temperature	TJ	-	-	150	掳C
Storage Temperature Range	TSTG	-55	-	150	掳C
Gate Charge	QG	-	60	-	nC	VGS = 15 V, ID = 80 A
Input Capacitance	Ciss	-	2200	-	pF	VDS = 400 V, f = 1 MHz
Output Capacitance	Coss	-	330	-	pF	VDS = 400 V, f = 1 MHz
Reverse Transfer Capacitance	Crss	-	110	-	pF	VDS = 400 V, f = 1 MHz
Threshold Voltage	VGS(th)	2.5	4	5.5	V	ID = 250 渭A, TA = 25掳C
On-State Resistance	RDS(on)	-	0.75	-	惟	VGS = 10 V, ID = 80 A, TA = 25掳C
Turn-On Delay Time	td(on)	-	35	-	ns	VGS = 15 V, ID = 80 A, Rg = 3.3 惟
Rise Time	tr	-	55	-	ns	VGS = 15 V, ID = 80 A, Rg = 3.3 惟
Turn-Off Delay Time	td(off)	-	25	-	ns	VGS = 15 V, ID = 80 A, Rg = 3.3 惟
Fall Time	tf	-	60	-	ns	VGS = 15 V, ID = 80 A, Rg = 3.3 惟

Instructions for Use:

1. Mounting and Handling:

   • Handle the device with care to avoid mechanical stress.
   • Ensure proper heat sinking to maintain junction temperature within safe limits.

2. Electrical Connections:

   • Connect the gate to the control circuit using a low inductance path.
   • Ensure the drain and source connections are secure and have low resistance.

3. Operating Conditions:

   • Do not exceed the maximum ratings listed in the table.
   • Operate within the specified temperature range to ensure reliable performance.

4. Gate Drive:

   • Use a gate resistor (R_g) to control switching speed and reduce electromagnetic interference (EMI).
   • Ensure the gate voltage (V_GS) is within the specified range to prevent damage.

5. Thermal Management:

   • Use appropriate cooling methods such as heatsinks or forced air cooling to manage heat dissipation.
   • Monitor the junction temperature to avoid thermal runaway.

6. Storage and Transportation:

   • Store the device in a dry, cool place away from direct sunlight.
   • Follow ESD (Electrostatic Discharge) precautions during handling and transportation.

7. Testing:

   • Use a suitable test setup to verify the device parameters before installation.
   • Refer to the datasheet for detailed testing procedures and conditions.

(For reference only)