Details

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BUY FCP13N60N https://www.utsource.net/itm/p/11301639.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source Voltage	VDS	-		600	V	Maximum voltage between drain and source with gate open
Gate-Source Voltage	VGS	-20		20	V	Maximum voltage between gate and source
Continuous Drain Current	ID	-	13	-	A	Continuous current flowing from drain to source
Pulse Drain Current	IDpeak	-	39	-	A	Peak current flowing from drain to source
Power Dissipation	PD	-		180	W	Maximum power dissipation at TC = 25掳C
Junction Temperature	TJ	-		175	掳C	Maximum junction temperature
Storage Temperature	TSTG	-55		150	掳C	Operating temperature range
Total Gate Charge	QG	-	43	-	nC	Total gate charge
Input Capacitance	Ciss	-	1700	-	pF	Input capacitance at VDS = 400V, VGS = 0V
Output Capacitance	Coss	-	280	-	pF	Output capacitance at VDS = 400V, VGS = 0V
Reverse Transfer Capacitance	Crss	-	25	-	pF	Reverse transfer capacitance at VDS = 400V, VGS = 0V
On-State Resistance	RDS(on)	-	0.9	-	惟	On-state resistance at VGS = 10V

Instructions for Use:

1. Mounting and Handling:

   • Ensure proper heat sinking to manage the maximum power dissipation.
   • Handle the device with care to avoid damage to the leads and the die.

2. Electrical Connections:

   • Connect the drain (D) to the high-voltage side of the circuit.
   • Connect the source (S) to the low-voltage side or ground.
   • Apply the gate (G) voltage carefully to control the switching action.

3. Operating Conditions:

   • Do not exceed the maximum ratings for V_DS, V_GS, I_D, and T_J.
   • Ensure that the operating temperature is within the specified range.

4. Gate Drive:

   • Use a gate resistor to control the switching speed and reduce electromagnetic interference (EMI).
   • Ensure the gate drive circuit can provide sufficient current to charge and discharge the gate capacitance quickly.

5. Thermal Management:

   • Use a heatsink with adequate thermal resistance to keep the junction temperature below the maximum limit.
   • Consider forced air cooling for high-power applications.

6. Storage and Handling:

   • Store the device in a dry, cool place away from direct sunlight.
   • Follow ESD (Electrostatic Discharge) precautions to prevent damage to the device.

7. Testing:

   • Use a curve tracer or a suitable test setup to verify the device parameters before installation.
   • Perform functional tests under controlled conditions to ensure reliable operation.

(For reference only)