Details

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BUY NUP4114HMR6T1G https://www.utsource.net/itm/p/11301643.html

Parameter	Description	Value	Unit
Part Number	Component Identifier	NUP4114HMR6T1G	-
Package Type	Physical Encapsulation	TSSOP-14	-
Operating Temperature	Range of temperatures where the device can operate reliably	-40 to 85	掳C
Storage Temperature	Range of temperatures where the device can be stored without damage	-65 to 150	掳C
Supply Voltage (Vcc)	Recommended operating voltage range	2.7 to 5.5	V
Maximum Output Current (Iout)	Maximum continuous output current per channel	150	mA
Channel Configuration	Number of channels and configuration	4-channel, high-side switch	-
Maximum Power Dissipation (Pd)	Maximum power dissipation at ambient temperature	400	mW
On-State Resistance (Rds(on))	Resistance when the switch is on	1.2	惟
Off-State Leakage Current (Ioff)	Leakage current when the switch is off	1	渭A
Input Voltage (Vin)	Input control voltage range for switching	0 to 5.5	V
Input Current (Iin)	Maximum input current required to drive the control input	10	渭A
Propagation Delay (tpd)	Time delay from input to output change	10	ns
Operating Humidity	Relative humidity range for reliable operation	0 to 95	% RH
ESD Rating	Electrostatic discharge tolerance	HBM: 2000	V

Instructions for Use:

1. Power Supply: Ensure the supply voltage (Vcc) is within the specified range of 2.7V to 5.5V.
2. Channel Operation: Each channel operates as a high-side switch. Connect the load between the output pin and ground.
3. Input Control: Apply a logic high (2.7V to 5.5V) to the input pin to turn the channel on, and a logic low (0V) to turn it off.
4. Thermal Management: Keep the junction temperature within the operating temperature range by ensuring adequate heat dissipation if the device is operating near its maximum power dissipation.
5. ESD Protection: Handle the device with care to avoid damage from electrostatic discharge. Use appropriate ESD protection measures during handling and assembly.
6. Storage: Store the device in a dry environment within the storage temperature range to prevent damage.
7. Humidity: Operate the device in environments with relative humidity between 0% and 95% to ensure reliable performance.
8. Layout Considerations: Ensure proper PCB layout to minimize noise and interference, especially for high-frequency applications.
9. Testing: Verify the functionality of the device using the specified test conditions and parameters before integrating it into your design.

(For reference only)