Details

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BUY IPA60R125P6 https://www.utsource.net/itm/p/11303462.html

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Continuous Drain Current	ID	-	44	50	A	@ Tc = 25掳C, VGS = 10V
Pulse Drain Current	IGM	-	132	150	A	@ Tc = 25掳C, VGS = 10V, t = 10 渭s
Maximum Drain-Source Voltage	VDS	600	-	-	V
Gate-Source Voltage	VGS	-10	0	15	V
Power Dissipation	PD	-	-	180	W	@ Tc = 25掳C
Junction Temperature	TJ	-55	-	175	掳C
Storage Temperature	Tstg	-55	-	150	掳C
Thermal Resistance	RthJC	-	0.5	-	掳C/W	Junction to Case
RthJA	-	-	3.5	-	掳C/W	Junction to Ambient

Instructions for Use:

1. Handling and Storage:

   • Store the device in a dry, cool place.
   • Handle with care to avoid static discharge and physical damage.

2. Mounting:

   • Ensure proper heat sinking to manage power dissipation, especially during high current operations.
   • Use recommended mounting torque for screws to ensure good thermal contact.

3. Electrical Connections:

   • Apply gate-source voltage (VGS) within the specified range to avoid damage.
   • Ensure drain-source voltage (VDS) does not exceed the maximum rating.
   • Use appropriate gate drive circuits to control switching times and reduce power losses.

4. Thermal Management:

   • Monitor junction temperature (TJ) to stay within safe operating limits.
   • Use thermal paste or thermal interface materials to improve heat transfer from the device to the heatsink.

5. Testing:

   • Perform initial testing at lower power levels to verify correct operation.
   • Use protective equipment and follow safety guidelines when handling high voltages and currents.

6. Application Considerations:

   • The device is suitable for applications requiring high efficiency and low on-state resistance, such as motor control, power supplies, and industrial electronics.
   • Refer to the datasheet for detailed application notes and circuit diagrams.

(For reference only)