Details

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Parameter	Symbol	Min	Typ	Max	Unit	Notes
Maximum Repetitive Peak Reverse Voltage	VRRM	-	-	40	V	-
Maximum DC Blocking Voltage	VRM	-	-	40	V	-
Maximum Average Rectified Output Current (Tamb = 25掳C)	IORM	-	-	1.0	A	-
Maximum Average Rectified Output Current (Tamb = 75掳C)	IORM	-	-	0.8	A	-
Maximum RMS Current (Sinusoidal Waveform, f = 50/60 Hz, Tamb = 25掳C)	IRMS	-	-	1.41	A	-
Maximum RMS Current (Sinusoidal Waveform, f = 50/60 Hz, Tamb = 75掳C)	IRMS	-	-	1.13	A	-
Maximum Non-Repetitive Surge Current (Half Sine-Wave, 8.3 ms)	IFSM	-	-	25	A	-
Forward Voltage at IF = 0.5 A	VF	-	1.0	1.3	V	-
Reverse Leakage Current at VR = 40 V, TA = 25掳C	IR	-	-	10	渭A	-
Operating Junction Temperature Range	TJ	-40	-	150	掳C	-
Storage Temperature Range	TSTG	-65	-	150	掳C	-

Instructions for Use:

1. Mounting:

   • Ensure the device is mounted on a PCB with proper thermal management to maintain operating temperatures within the specified range.
   • Use recommended soldering profiles to avoid thermal stress during assembly.

2. Electrical Connections:

   • Connect the anode and cathode terminals correctly to avoid reverse polarity, which can lead to device failure.
   • Ensure all connections are secure and free from shorts or open circuits.

3. Thermal Management:

   • Provide adequate cooling, such as heatsinks or forced air cooling, if operating near the maximum current ratings.
   • Monitor the junction temperature to ensure it does not exceed 150掳C.

4. Surge Handling:

   • The device can handle non-repetitive surge currents up to 25 A for a half-sine wave of 8.3 ms. Ensure that any surge conditions do not exceed this limit.

5. Reverse Voltage:

   • Do not exceed the maximum repetitive peak reverse voltage (VRRM) of 40 V to prevent breakdown and potential damage to the device.

6. Forward Current:

   • Operate the device within the specified forward current limits to avoid overheating and ensure reliable performance.

7. Storage:

   • Store the device in a dry, cool environment within the storage temperature range (-65掳C to 150掳C).

8. Handling:

   • Handle the device with care to avoid mechanical damage or electrostatic discharge (ESD), which can degrade performance or cause failure.

9. Testing:

   • Perform regular testing and inspection to ensure the device is functioning within specifications and to identify any potential issues early.

10. Compliance:

    • Ensure the device meets all relevant safety and regulatory standards for the application in which it is used.

(For reference only)