Details

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BUY SDINBDG4-8G https://www.utsource.net/itm/p/11304213.html

Parameter	Description	Value	Unit
Part Number	Full part number	SDINBDG4-8G	-
Type	NAND Flash Memory	-	-
Capacity	Storage capacity	8	GB
Package	Package type	BGA	-
Operating Voltage (Vcc)	Supply voltage for operation	1.8 ± 0.15	V
I/O Voltage (VccQ)	Input/output voltage	1.8 ± 0.15	V
Data Interface	Interface type	Toggle Mode 2.0	-
I/O Size	Number of data lines	8	bits
Die Configuration	Number of dies per package	4	-
Page Size	Size of a single page	8192 + 768	bytes
Block Size	Size of a single block	512	pages
Program Time	Maximum time to program a page	1200	μs
Erase Time	Maximum time to erase a block	2000	μs
Read Time	Maximum time to read a page	70	μs
Endurance	Number of program/erase cycles per block	3000	-
Retention	Data retention at 25°C	10 years	-
Operating Temperature	Temperature range for operation	-40 to 85	°C
Storage Temperature	Temperature range for storage	-40 to 85	°C
Dimensions	Physical size of the package	16 x 20 x 1.2	mm

Instructions:

1. Power Supply:

   • Ensure that the supply voltage (Vcc) is within the specified range of 1.8 ± 0.15V.
   • The input/output voltage (VccQ) should also be within the same range.

2. Data Interface:

   • Use the Toggle Mode 2.0 interface for communication with the device.
   • The device supports 8-bit data lines for I/O operations.

3. Programming and Erasing:

   • The maximum time to program a single page is 1200 μs.
   • The maximum time to erase a single block is 2000 μs.
   • Each block can withstand up to 3000 program/erase cycles.

4. Reading:

   • The maximum time to read a single page is 70 μs.

5. Temperature:

   • The operating temperature range is from -40°C to 85°C.
   • The storage temperature range is also from -40°C to 85°C.

6. Handling:

   • Handle the device with care to avoid damage.
   • Follow ESD (Electrostatic Discharge) precautions to prevent damage to the device.

7. Storage:

   • Store the device in a dry, cool place to ensure data retention.

8. Mounting:

   • Ensure proper mounting on the PCB to avoid mechanical stress and ensure reliable operation.

(For reference only)