Details

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BUY 16N50ES https://www.utsource.net/itm/p/11304670.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	Vcc	4.5	5	5.5	V	Operating voltage range
Output Current	Iout	-	20	25	mA	Maximum output current per channel
Operating Frequency	fmax	-	1	10	MHz	Maximum operating frequency
Input Capacitance	Cin	-	10	15	pF	Input capacitance
Output Capacitance	Cout	-	5	10	pF	Output capacitance
Propagation Delay	tpd	20	35	50	ns	Propagation delay time
Power Dissipation	Pd	-	100	150	mW	Maximum power dissipation
Operating Temperature	Temp	-40	-	85	掳C	Operating temperature range
Storage Temperature	Tstg	-65	-	150	掳C	Storage temperature range

Instructions for Using 16N50ES

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
   • Use a stable power source to avoid fluctuations that could affect performance.

2. Output Current:

   • Do not exceed the maximum output current of 25mA per channel to prevent damage to the device.
   • If higher currents are required, consider using external drivers or buffers.

3. Operating Frequency:

   • The device can operate up to a maximum frequency of 10MHz. Ensure your application does not exceed this limit to maintain reliable operation.

4. Capacitance:

   • Be aware of the input and output capacitance values when designing your circuit. These can affect signal integrity and timing.
   • Use appropriate decoupling capacitors near the power supply pins to reduce noise and improve stability.

5. Propagation Delay:

   • The propagation delay time (tpd) ranges from 20ns to 50ns. Consider this delay in your timing calculations to ensure proper synchronization.

6. Power Dissipation:

   • The maximum power dissipation is 150mW. Ensure adequate heat dissipation if the device is operating near this limit to prevent overheating.

7. Temperature Range:

   • The operating temperature range is -40掳C to 85掳C. Ensure the device is used within this range to avoid thermal stress.
   • For storage, the temperature range is -65掳C to 150掳C. Store the device in a dry, cool place to prevent damage.

8. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Use proper ESD (Electrostatic Discharge) protection practices during handling and assembly.

9. Mounting:

   • Follow the recommended PCB layout guidelines to ensure optimal performance and reliability.
   • Ensure proper soldering techniques to avoid cold solder joints or excessive heat that could damage the device.

10. Testing:

    • Before deploying the device in a final application, thoroughly test it under various conditions to ensure it meets all performance specifications.

(For reference only)