Details

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BUY TLP250 DIP https://www.utsource.net/itm/p/11530657.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	4.5	-	20	V
Output Voltage (High Level)	VOH	2.4	-	VCC-1	V	IO = -10mA, VCC = 5V
Output Voltage (Low Level)	VOL	-	-	0.4	V	IO = 10mA, VCC = 5V
Input Current (Forward)	IF	5	-	20	mA
Input Current (Reverse)	IR	-	-	1	mA
Isolation Voltage	VIORM	-	-	1500	Vrms	1 min, 50/60 Hz
Propagation Delay Time	tPLH, tPHL	-	30	70	ns	IF = 10mA, VCC = 5V, RL = 500惟
Storage Temperature Range	Tstg	-40	-	105	掳C
Operating Temperature Range	Topr	-40	-	85	掳C

Instructions for Using TLP250 DIP

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the range of 4.5V to 20V.
   • Connect the VCC pin to the positive supply and GND pin to the ground.

2. Input Signal:

   • Apply the input signal to the Anode (A) and Cathode (K) pins.
   • The forward current (IF) should be between 5mA and 20mA for reliable operation.
   • Avoid exceeding the reverse current (IR) of 1mA to prevent damage.

3. Output Signal:

   • The output pins (COL and EM) can drive a load with a high-level output voltage (VOH) typically around VCC - 1V and a low-level output voltage (VOL) of 0.4V or less.
   • Ensure the load resistance (RL) is appropriate for the desired current.

4. Isolation:

   • The TLP250 provides galvanic isolation up to 1500Vrms for 1 minute at 50/60 Hz.
   • This isolation helps protect against electrical noise and high-voltage spikes.

5. Timing:

   • The propagation delay time (tPLH, tPHL) is typically 30ns to 70ns under standard conditions (IF = 10mA, VCC = 5V, RL = 500惟).
   • Consider this delay when designing your circuit to ensure proper timing.

6. Temperature:

   • The storage temperature range is -40掳C to 105掳C, and the operating temperature range is -40掳C to 85掳C.
   • Avoid operating the device outside these ranges to prevent performance degradation or damage.

7. Handling:

   • Handle the TLP250 with care to avoid static discharge, which can damage the internal components.
   • Use proper anti-static precautions when handling and soldering the device.

8. Mounting:

   • Ensure the device is securely mounted on the PCB to prevent mechanical stress.
   • Follow the recommended soldering profile to avoid thermal damage during assembly.

By following these guidelines, you can ensure reliable and efficient operation of the TLP250 DIP optocoupler in your application.

(For reference only)