IRF740 NEW ORIGINAL

IRF740 NEW ORIGINAL

Category: Transistors

Specifications
Details

BUY IRF740 NEW ORIGINAL https://www.utsource.net/itm/p/11530751.html

Parameter Symbol Min Typ Max Unit Condition
Drain-Source Voltage VDSS - - 400 V
Gate-Source Voltage VGS -15 - 20 V
Continuous Drain Current ID - 7.6 - A TC = 25°C
Pulse Drain Current Ibm - 39 - A tp = 10ms, TC = 25°C
Input Capacitance Ciss - 1600 - pF VDS = 25V, VGS = 0V
Output Capacitance Coss - 380 - pF VDS = 25V, VGS = 0V
Reverse Transfer Capacitance Crss - 470 - pF VDS = 25V, VGS = 0V
Gate Charge Qg - 58 - nC VGS = 10V
Total Power Dissipation PD - 41 - W TC = 25°C
Junction Temperature Tj -55 - 150 °C
Storage Temperature Tstg -55 - 150 °C

Instructions for Use:

  1. Handling Precautions:

    • Ensure proper ESD protection when handling the IRF740 to prevent damage from static electricity.
  2. Mounting:

    • Mount the device on a heatsink if operating at high power levels to maintain junction temperature within specified limits.
  3. Biasing:

    • Apply gate voltage carefully not to exceed the maximum ratings of VGS. The typical operating range is between -15V and +20V.
  4. Operation:

    • Ensure that the drain-source voltage (VDSS) does not exceed 400V to avoid breakdown.
    • Limit continuous drain current (ID) to 7.6A at 25°C case temperature. For higher temperatures or pulse conditions, refer to the pulse drain current (Ibm).
  5. Storage:

    • Store in a dry environment within the storage temperature range (-55°C to 150°C).
  6. Capacitance Considerations:

    • Be aware of the input (Ciss), output (Coss), and reverse transfer capacitances (Crss) which can affect switching performance.
  7. Power Dissipation:

    • Keep total power dissipation (PD) within safe limits by ensuring adequate heat sinking or cooling measures.
  8. Temperature Management:

    • Monitor junction temperature (Tj) to ensure it stays within operational limits (-55°C to 150°C).
(For reference only)

View more about IRF740 NEW ORIGINAL on main site